Modular Data Pod Cooling with Hybrid Free-Cooling and Mechanical Trim
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Solution Overview
Problem
Traditional data center cooling systems are inefficient, leading to high costs and energy consumption due to oversized infrastructure, limited geographical applicability, and inability to handle high-density data centers effectively.
Innovation Solution
The development of modular data pod systems with close-coupled cooling systems that utilize polygonal shapes for efficient air circulation and a hybrid cooling approach combining free-cooling and mechanical sub-cooling, allowing for flexible deployment and high-density cooling without the need for traditional chiller systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional chiller plants are used to cool entire data centers, then cooling capacity is sufficient, but energy consumption increases significantly and cost efficiency decreases
Solution Approach 1:
The data center is divided into multiple modular data pods, each with its own dedicated cooling system. This segmentation allows each module to be cooled independently based on its actual IT equipment load, preventing energy waste on empty or low-load areas while ensuring sufficient cooling capacity where needed.
Solution Approach 2:
Each data pod is equipped with locally-controlled cooling systems that adjust cooling output based on the specific thermal load of IT equipment within that pod. This local quality approach ensures cooling capacity matches actual demand in each zone, significantly reducing overall energy consumption compared to uniform cooling of the entire facility.
2Reliability
If traditional chiller plants are designed based on peak power consumption capacity, then sufficient cooling is provided, but efficiency drops significantly during load fluctuations
Solution Approach 1:
The modular cooling systems in each data pod are dynamically adjustable and can scale their cooling output to match the actual IT equipment load in real-time. This dynamic capability allows the system to maintain high efficiency during load fluctuations while still providing sufficient cooling capacity when needed, eliminating the efficiency penalty of oversized traditional systems.
Solution Approach 2:
The modular design allows cooling capacity to be pre-configured in discrete units that can be activated or deactivated based on anticipated or actual load requirements. This preliminary structuring enables the system to efficiently adapt to varying demands without the inefficiency of continuously running oversized equipment.
3Ease of manufacture
If air-cooled free cooling systems are used, then cost is reduced, but geographical applicability is limited to cool, dry climates
Solution Approach 1:
The data pod cooling system is designed with multi-functionality to operate effectively across diverse geographical environments. Each pod can switch between different cooling modes (free cooling, adiabatic cooling, mechanical cooling) depending on ambient conditions, making the system universally applicable whether in cool dry climates, hot humid climates, or intermediate conditions, while maintaining cost-effectiveness.
Solution Approach 2:
The system adapts to different geographical conditions by changing its operational parameters - using free cooling mode in cool climates, transitioning to adiabatic-assisted cooling in warmer conditions, and employing mechanical cooling only when necessary in hot humid climates. This parameter adjustment allows the same modular system design to be cost-effective across a wide range of geographical locations.
4Adaptability or versatility
If adiabatic-assisted cooling systems are used, then geographical reach is expanded, but cooling tolerance limitations prevent sufficient cooling for high density data centers
Solution Approach 1:
The system merges multiple cooling approaches - free cooling, adiabatic cooling, and mechanical cooling - into a unified modular data pod architecture. This combination allows the system to leverage the geographical adaptability of adiabatic cooling while supplementing it with mechanical cooling capacity when high heat loads from dense IT equipment require additional cooling tolerance, thus achieving both broad geographical reach and sufficient cooling capability for high-density applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces energy consumption and operational costs, enables efficient cooling in high-density data centers, and allows for flexible deployment in various environments, improving power use efficiency and scalability.
Implementation Method 1
a heat exchange member coupled to the first cooling circuit. The second cooling circuit is configured to cool the plurality of servers
Implementation Method 2
The second cooling circuit includes a secondary cooling device configured to cool fluid flowing through the second cooling circuit
Implementation Method 3
an air-cooled 'free cooling' system (also referred to as a straight air-cooled system) uses ambient air as a medium to cool server racks
Implementation Method 4
The adiabatic-assisted system is a cooling system assisted by adiabatic water
Data Source
Figure 1
Figure 2A~2B
Figure 2C~2D
AI summary
A space-saving, high-density modular data pod system and an energy-efficient cooling system are disclosed. The modular data pod system includes a central free- cooling system and a plurality of modular data pods, each of which includes a heat exchange assembly coupled to the central free-cooling system, and a distributed mechanical cooling system coupled to the heat exchange assembly. The modular data pods include a data enclosure having at least five walls arranged in the shape of a polygon, a plurality of computer racks arranged in a circular or U-shaped pattern, and a cover to create hot and cold aisles, and an air circulator configured to continuously circulate air between the hot and cold aisles. Each modular data pod also includes an auxiliary enclosure containing a shared fluid and electrical circuit section that is configured to connect to adjacent shared fluid and electrical circuit sections to form a shared fluid and electrical circuit that connects to the central free-cooling system. The auxiliary enclosure contains at least a portion of the distributed mechanical cooling system, which is configured to trim the cooling performed by the central free-cooling system.