Modular Deformable Electronics Platform for Skin-Mounted Devices
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Solution Overview
Problem
Flexible electronic devices struggle to maintain adherence and functionality on irregular and dynamically deforming surfaces due to limited stretchability and delamination issues, which leads to discomfort and operational interruptions.
Innovation Solution
A modular deformable electronics platform composed of discrete flexible tiles with flexible corner connections and interconnects, allowing tiles to translate and rotate while maintaining electrical communication, and featuring a passivation layer for flexible corner connections, enabling the platform to flex and adapt to complex three-dimensional motions without delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a flexible substrate patch is used to mount electronic components, then the device can conform to irregular surfaces, but the device has limited stretchability and causes delamination when subjected to complex three-dimensional motion
Solution Approach 1:
The flexible substrate is divided into multiple discrete tiles connected by flexible corner connections. This segmentation allows each tile to independently respond to surface deformation, preventing delamination while maintaining overall device functionality on complex three-dimensional surfaces.
Solution Approach 2:
The device incorporates flexible corner connections that enable dynamic translation and rotation of tiles relative to each other. This dynamic capability allows the device to adapt to complex three-dimensional motion patterns, maintaining adherence stability throughout the range of motion.
2Ease of manufacture
If adhesive material is applied to the substrate patch, then the device can be mounted on surfaces, but the adhesive fails when the device cannot accommodate three-dimensional motion
Solution Approach 1:
By dividing the substrate into discrete tiles with flexible corner connections, the adhesive is distributed across multiple smaller bonding points rather than a single large continuous adhesive layer. This segmentation allows the adhesive to accommodate three-dimensional motion without failing, while maintaining ease of manufacture through standard substrate preparation processes.
3Stability of the object's composition
If the substrate is made rigid to maintain electrical component integrity, then component stability is improved, but the device cannot accommodate deformation of the underlying surface
Solution Approach 1:
The substrate is segmented into discrete tiles that can independently deform, while electrical components remain stable on each tile. The flexible corner connections allow tiles to move relative to each other, accommodating surface deformation without compromising component stability.
Solution Approach 2:
Different regions of the device have different mechanical properties: the substrate tiles are flexible to accommodate deformation, while the electrical components and their immediate support structures maintain local rigidity for stability. This local quality differentiation resolves the contradiction between overall flexibility and component stability.
4Adaptability or versatility
If cuts or perforations are added to increase stretchability, then the device can accommodate more deformation, but the device complexity and production cost increase
Solution Approach 1:
Instead of adding cuts or perforations to a continuous substrate, the device uses discrete tiles connected by flexible corner connections. This segmentation approach achieves enhanced stretchability while maintaining simpler manufacturing processes, as the tiles can be formed using standard substrate preparation techniques without requiring complex cutting or perforation patterns.
Data Source
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AI summary
A modular deformable electronics platform is attachable to a deformable surface, such as skin. The platform is tolerant to surface deformation and motion, can flex in and out of a plane of the platform without hindering operability of electrical components included on the platform, and is formed via arrangement of discrete flexible tiles, with corners of adjacent tiles connected by a flexible connection material so that individual tiles can translate and rotate relative to each other. Interconnects disposed on bases of separate tiles electrically connect adjacent tiles via their connected corners, and electrically connect components disposed on different tiles. Each pair of adjacent corner connections defines an axis about which at least a portion of the platform can flex without deformation and without hindering connections between tiles. The flexible material and/or bases of the tiles can include Parylene.