Modular Detector Module for Aircraft Image Capture
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Solution Overview
Problem
Current optoelectronic image capture systems for aircraft, such as spacecraft, face challenges with high-resolution sensors that require compact and efficient packaging, precise adjustment, and effective thermal management due to the limitations of planar monolithic focal plane arrays (FPAs), which hinder the utilization of higher integration density and performance.
Innovation Solution
A modular detector module design with optoelectronic elements arranged in a series along a main module body, allowing for overlapping pixel lines, integrated signal processing, and a modular FPA structure that enables flexible thermal management through varied material thicknesses and cooling/heating apparatuses, optimizing image field correction and thermal distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a planar monolithic FPA structure is used, then the structural simplicity and ease of manufacture are improved, but the integration density and thermal management capability deteriorate
Solution Approach 1:
The patent divides the monolithic FPA base plate into a modular structure with multiple carrier plates arranged in a stack. Each carrier plate can independently carry sensors and peripheral components, enabling higher integration density while maintaining manufacturing simplicity through standardized modular units.
Solution Approach 2:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional stacked configuration. Sensors and peripheral components are distributed across multiple layers in the vertical dimension, significantly increasing integration density without compromising the ease of manufacture of individual layers.
2Ease of operation
If sensors are assembled in separate housings on a monolithic base plate, then the ease of assembly is improved, but the thermal behavior and mechanical-thermal properties deteriorate
Solution Approach 1:
The patent merges the sensor housing and peripheral component housing into a single integrated carrier plate structure. This combination maintains ease of assembly through modular replacement while improving thermal behavior by providing a unified thermal path and eliminating thermal discontinuities at housing interfaces.
Solution Approach 2:
The carrier plates are designed with composite structures that combine materials with different thermal properties. This allows optimization of thermal conduction paths to sensors while maintaining mechanical stability and ease of assembly for the overall module.
3Adaptability or versatility
If apertures are created in the FPA base plate for electronic components, then the functionality is improved, but the mechanical-thermal properties and production difficulty worsen
Solution Approach 1:
The patent segments the FPA structure into separate carrier plates, with peripheral components mounted on the rear side of each carrier plate rather than requiring apertures through the base plate. This eliminates complex aperture production while maintaining full functionality through distributed component placement.
4Speed
If optical links are placed close to data sources for high bandwidth, then the data transmission capability is improved, but the space requirements and thermal management difficulty worsen
Solution Approach 1:
The patent utilizes the vertical dimension by stacking optical links and sensors on different layers of the carrier plate structure. This three-dimensional arrangement places optical links close to data sources for high-speed transmission while efficiently utilizing vertical space rather than consuming additional horizontal area.
5Manufacturing precision
If sensors are non-detachably fastened for precise fixation, then the positioning precision is improved, but the ease of repair and replacement worsens
Solution Approach 1:
The patent segments the sensor assembly into modular carrier plate units. Sensors are precisely fixed to their respective carrier plates with high positioning precision, while entire carrier plate modules can be easily replaced as units. This segmentation maintains precision fixation while dramatically improving ease of repair through modular replacement.
Data Source
AI summary
A detector module for image capture, in particular for an optoelectronic image capture system for an aircraft, such as a spacecraft, comprising a main module body and at least one optoelectronic element arranged on and/or integrated in the main module body, wherein the at least one optoelectronic element has at least one line with a multiplicity of pixels, such as pixel line, and an optoelectronic image capture system and aircraft, such as spacecraft.