Modular Detector Tile Sub-Assemblies for Selective Component Replacement
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Solution Overview
Problem
Current indirect conversion radiation detector arrays face challenges in high throughput and volume imaging applications due to the need for large numbers of detector pixels and channels, leading to complex and costly detector measurement systems where individual components of tiles must be replaced entirely when malfunctioning.
Innovation Solution
The design of a tile for an indirect-conversion radiation detector assembly, comprising a scintillator element, an array of photodetectors, and separate detector and electronic sub-assemblies that can be selectively decoupled and replaced independently, allowing for modular replacement of faulty components without replacing the entire detector array.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the detector array uses a large number of detector pixels and channels to achieve high throughput and volume imaging, then the imaging capability and productivity are improved, but the device complexity and manufacturing cost increase significantly
Solution Approach 1:
The detector array is segmented into multiple independent tiles, each tile containing a subset of detector pixels and associated electronics. This segmentation allows the large detector system to be divided into manageable modules that can be independently manufactured, tested, and replaced, thereby reducing the overall system complexity while maintaining high throughput imaging capability through parallel operation of multiple tiles.
2Ease of manufacture
If the entire tile must be replaced when any component malfunctions, then system reliability is simplified, but maintenance cost and downtime increase
Solution Approach 1:
Each tile is further segmented into distinct functional sub-assemblies (detector sub-assembly and electronic sub-assembly) that can be independently replaced. This nested segmentation allows for granular repair strategies where only the malfunctioning sub-assembly needs to be replaced rather than the entire tile, significantly reducing maintenance costs and downtime while maintaining ease of manufacture through standardized modular components.
3Stability of the object's composition
If individual components of tiles cannot be replaced separately, then the structural integrity is maintained, but the adaptability and ease of repair deteriorate
Solution Approach 1:
The tile is segmented into standardized sub-assemblies with defined interfaces that maintain structural integrity when assembled, while enabling flexible replacement of individual sub-assemblies. The detector sub-assembly and electronic sub-assembly are designed as separate replaceable units with standardized connection interfaces, allowing the structural integrity of the overall tile to be maintained while providing adaptability for selective component replacement based on malfunction patterns.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This modular approach reduces maintenance costs and improves system reliability by enabling the replacement of specific sub-assemblies, maintaining detector array functionality without the need to replace entire tiles or arrays.
Implementation Method 1
a scintillator element, a photodetector array disposed on a top surface of the substrate and operably coupled with the scintillator element
Implementation Method 2
an array of photodetectors disposed on a top surface of the substrate and operably coupled with the scintillator element
Data Source
AI summary
Among other things, one or more tiles for an indirect-conversation radiation detector array are provided herein. Respective tiles comprise a detector sub-assembly and an electronic sub-assembly, which are operably coupled together, yet selectively removable, via a connection interface. When an electronic sub-assembly portion of a tile, which comprises a signal acquisition system (e.g., an integrated circuit, such as an application specific integrated circuit (ASIC)), functions improperly, the electronic sub-assembly portion of the tile may be selectively removed for repair/replacement without removing and/or replacing the detector sub-assembly (e.g., which may be much more costly to replace). Similarly, when the detector sub-assembly portion of a tile functions improperly, the detector sub-assembly portion of the tile may be selectively removed for repair/replacement without removing and/or replacing the electronic sub-assembly portion of the tile (e.g., although some manipulation of the properly functioning sub-assembly may occur).


