Modular Diagnostic Wafer with Removable Sensor Pucks
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Solution Overview
Problem
Conventional semiconductor processing chamber monitoring systems face challenges in accurately measuring operating conditions at the substrate surface due to sensor placement away from the substrate, potential disruption of chamber conditions, and the difficulty of manufacturing and replacing diagnostic wafers with integrated sensors.
Innovation Solution
Diagnostic wafers with removable sensor pucks that can be configured to monitor various conditions, allowing for customizable monitoring setups, quick replacement of faulty pucks, and faster charging of battery pucks to minimize downtime, while maintaining a design that mimics the substrate to avoid perturbing chamber conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If sensors are integrated into the wafer body, then measurement precision is improved, but device complexity increases
Solution Approach 1:
The diagnostic wafer is segmented into a modular architecture with multiple recesses that can independently receive different sensor pucks. Each sensor puck is a separate, replaceable unit containing specific sensing elements. This segmentation allows the system to achieve high measurement precision through multiple specialized sensors while managing complexity through modularity and interchangeability.
2Adaptability or versatility
If multiple sensors are integrated into the wafer, then adaptability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The wafer body is divided into multiple recesses that can independently accommodate different types of sensor pucks. This segmentation enables adaptability by allowing the system to be configured with various sensor combinations for different measurement needs, while each individual recess and puck can be manufactured with standard precision requirements rather than requiring the entire multi-sensor assembly to be manufactured with high precision.
Solution Approach 2:
The wafer body is designed with universal recesses that can receive multiple types of sensor pucks. Each recess is standardized to accommodate different sensor configurations, providing multi-functionality and adaptability. This universal design allows the same wafer body to be used with various sensor combinations without requiring custom manufacturing for each configuration.
3Reliability
If diagnostic wafers are designed with integrated sensors, then reliability is improved, but ease of repair deteriorates
Solution Approach 1:
The sensor system is segmented into replaceable sensor pucks that can be independently removed and replaced. If a sensor fails, only the specific sensor puck containing the faulty sensor needs to be replaced, not the entire diagnostic wafer. This segmentation maintains reliability through continuous operation capability while dramatically improving ease of repair through simple puck replacement.
Solution Approach 2:
The modular sensor puck design allows for easy discarding of faulty sensors and recovery of the functional wafer body and other sensors. When a sensor fails, the defective puck can be quickly removed and replaced with a new or refurbished puck, while the remaining functional components are recovered and can continue operation or be reused.
4Ease of operation
If sensor pucks are made removable, then ease of operation is improved, but device complexity increases
Solution Approach 1:
The diagnostic wafer is segmented into a base wafer body with standardized recesses and separate sensor pucks. This segmentation enables easy operation by allowing users to simply insert or remove sensor pucks from the recesses without complex tools or procedures. The standardized interface between recesses and pucks simplifies the operation while the modular architecture manages the inherent complexity through clear separation of components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate and flexible monitoring of semiconductor processing chamber conditions without disrupting the chamber, allowing for real-time data collection and reducing downtime due to the modular design and quick replacement of sensor pucks.
Implementation Method 1
each of the at least one sensor puck may include at least one sensor selected from the group consisting of: temperature sensors, pressure sensors, retarding field energy analyzers (RFEA), plasma probes, optical emission probes for plasma diagnostics, visible light sensors, IR light sensors/cameras
Implementation Method 2
each of the at least one sensor puck may include at least one sensor selected from the group consisting of: temperature sensors, pressure sensors, retarding field energy analyzers (RFEA), plasma probes, optical emission probes for plasma diagnostics, visible light sensors, IR light sensors/cameras
Implementation Method 3
optical emission probes for plasma diagnostics
Data Source
AI summary
Exemplary diagnostic wafers for a semiconductor processing chamber may include a wafer body defining a plurality of recesses. The diagnostic wafers may include at least one data logging puck positionable within one of the plurality of recesses. The diagnostic wafers may include at least one battery puck positionable within one of the plurality of recesses. The diagnostic wafers may include at least one sensor puck positionable within one of the plurality of recesses.