Modular Die Packaging Architecture for Mixed-Size 3D Integration

The patent transitions from 2D planar arrangement of IC dies to 3D stacked architecture, where dies are arranged in multiple vertical layers. This dimensional change allows significantly more dies to be integrated within the same package substrate footprint by utilizing the vertical dimension for stacking multiple die layers with interconnect structures between them.

The patent implements a hierarchical nesting structure where multiple layers of IC dies are nested vertically within a single package substrate. Each die layer contains multiple dies, and these layers are stacked one above another, creating a nested configuration that maximizes the use of the package substrate area while accommodating a large number of dies.

The patent applies local quality by allowing the interposer or EMIB structure to have varying dimensions at different locations. Specifically, the interconnect structures within the interposer can be configured with different sizes, shapes, and densities to match the specific requirements of each die being connected, enabling accommodation of differently sized dies while maintaining overall manufacturing simplicity through standardized fabrication processes.

The patent introduces dynamic configurability in the interposer design, where the interconnect layout and dimensions can be adjusted based on the specific die configuration being packaged. This allows the same interposer fabrication process to produce interposers with varying characteristics to match different die sizes and arrangements, providing adaptability without requiring complete redesign of the manufacturing process.