Modular Die Handling System for Concurrent Wafer Processing
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Solution Overview
Problem
Current wafer handling systems are limited by their ability to process only a single wafer size at a time, requiring serial processing and significant idle time for hardware changes, which increases the risk of material damage and reduces efficiency.
Innovation Solution
A modular die handling system that includes a wafer handling module capable of preparing and storing pre-expanded wafers of various sizes, allowing concurrent expansion and die extraction processes without interrupting the die handler, enabling continuous operation with minimal idle time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single wafer size is processed at a time using traditional handling systems, then the hardware configuration is simple, but the productivity is reduced due to serial processing and significant idle time for hardware changes
Solution Approach 1:
The wafer handling system is divided into modular components including multiple cassettes for different wafer sizes, separate expansion modules, and independent die handlers. This segmentation allows each module to operate autonomously and be configured for different wafer sizes without halting the entire system, enabling parallel processing of multiple wafer types simultaneously
Solution Approach 2:
The system employs dynamic reconfiguration capabilities where cassette assignments and expansion ratios can be changed on-the-fly without physical hardware changes. The die handler can dynamically select which cassette to process next and adjust expansion parameters based on the specific wafer size being processed, eliminating idle time associated with static hardware reconfiguration
2Adaptability or versatility
If hardware changes are performed to accommodate different wafer sizes, then the system becomes more versatile, but the risk of material damage increases due to frequent reconfigurations
Solution Approach 1:
The system uses universal cassette designs that can accommodate multiple wafer sizes through software configuration rather than physical modification. The expansion module and die handler are designed to work with various wafer dimensions by adjusting control parameters, eliminating the need for frequent hardware changes and reducing the risk of material damage during reconfiguration
Solution Approach 2:
The system creates virtual representations of different wafer configurations through software models rather than physical hardware copies. Each wafer size has an associated digital template that guides the expansion and die extraction processes, allowing the system to adapt to different wafer sizes without physical reconfiguration that could damage materials
3Productivity
If serial processing is used for different wafer sizes, then the system complexity is low, but the productivity decreases due to halted die extraction processes
Solution Approach 1:
The modular architecture enables continuous die extraction operations by maintaining separate processing streams for different wafer sizes. While one cassette is being processed, the die handler can simultaneously prepare or process other cassettes, ensuring that the useful action of die extraction continues without interruption regardless of wafer size changes
Solution Approach 2:
The system performs preliminary setup and configuration of expansion parameters and die extraction patterns in advance for each wafer size type. These pre-configured settings are stored and automatically loaded when a specific cassette type is selected, eliminating the need for time-consuming real-time reconfiguration and maintaining continuous productivity
Data Source
AI summary
Die handling systems and methods of use for preparing or processing dies from multiple types of pre-expanded wafer materials. The die handling systems are configured in a modular fashion, allowing for concurrent processes to expand the wafers, process the wafers, extract the dies, and inspect the extracted dies without forcing one of the processes of the system to remain idle. Embodiments of the wafer handler module include a mechanism, such as an expander capable of stretching or expanding wafers having one or more different sizes to a pre-expanded state without interrupting the die handler. The pre-expanded wafers are stored as a proprietary cartridge and delivered to the die handler, where a pick head of the die handler removes each die of the pre-expanded wafer and delivers the extracted dies to subsequent machinery, such as a pick and place machine, for further processing.