Modular Die-Level Liquid Cooling for High-Power ICs
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Solution Overview
Problem
High-power integrated circuit devices face thermal management challenges due to increasing thermal design power and high thermal resistance from die backside film polymeric layers, which traditional air cooling methods struggle to compensate, especially in multi-chip packages and high-power server products.
Innovation Solution
A modular die-level liquid cooling technique involving laterally disposed channels in secondary dies connected to active dies via thermally conductive materials, eliminating conventional thermal interface materials and using a manifold with distributor and collector assemblies for fluid flow, along with a feedback loop for temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional air cooling methods are used, then device simplicity is maintained, but thermal management performance deteriorates due to high thermal resistance from die backside film polymeric layers
Solution Approach 1:
The cooling system is segmented into multiple functional components: a heat spreader layer directly coupled to the die, a manifold assembly with distributor and collector assemblies, and laterally disposed channels in secondary dies. This segmentation allows each component to be optimized for its specific function while collectively achieving superior thermal management performance that overcomes the limitations of traditional air cooling methods.
Solution Approach 2:
The invention transitions from air cooling to liquid cooling by implementing a manifold assembly with distributor and collector assemblies that deliver coolant through laterally disposed channels in secondary dies. This hydraulic approach enables more effective heat removal from high-power integrated circuit devices, addressing the thermal management challenges that air cooling cannot overcome due to high thermal resistance from die backside film polymeric layers.
2Temperature
If conventional thermal interface materials are used, then ease of manufacture is improved, but thermal performance deteriorates due to high thermal resistance
Solution Approach 1:
The invention extracts and eliminates conventional thermal interface materials from the thermal path by implementing direct liquid cooling through laterally disposed channels in secondary dies. The manifold assembly delivers coolant directly to the heat spreader layer, removing the need for thermal interface materials that introduce high thermal resistance, thereby achieving superior thermal performance without sacrificing manufacturability.
Solution Approach 2:
The cooling approach transitions from vertical heat transfer through thermal interface materials to lateral heat transfer through channels in secondary dies. The laterally disposed channels enable coolant flow parallel to the die surface, creating a new dimensional approach to thermal management that eliminates the need for thermal interface materials while maintaining ease of manufacture.
3Adaptability or versatility
If multi-chip packages are implemented, then device functionality is improved, but thermal management becomes more difficult due to increased power density and thermal resistance
Solution Approach 1:
The manifold assembly with distributor and collector assemblies serves multiple functions: it delivers coolant to multiple secondary dies simultaneously, collects heated coolant from all channels, and provides a unified thermal management solution for multi-chip packages. This multi-functional design enables effective thermal management of high-power density multi-chip packages while maintaining device functionality and adaptability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat transfer efficiency by directly managing thermal interfaces at the die level, reducing thermal resistance and improving cooling performance without the need for conventional thermal interface materials, effectively addressing the thermal challenges in high-power microprocessors and multi-chip packages.
Implementation Method 1
connected to active dies via thermally conductive materials
Implementation Method 2
laterally disposed channels in secondary dies connected to active dies via thermally conductive materials
Data Source
AI summary
An integrated circuit assembly including a first die including a device side and a backside opposite the device side; and a second die including a plurality of fluidly accessible channels therein, wherein the second die is coupled to a backside of the first die. A method of fabricating an integrated circuit assembly including coupling a first die to a second die, wherein the first die includes a device side and an opposite backside, wherein the device side includes a plurality of integrated circuits and wherein the second die includes a plurality of fluidly accessible channels therein.