Modular Die Stack Package for Signal Integrity and Dense Integration

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional semiconductor packages face challenges in maintaining signal integrity, managing thermal dissipation, ensuring reliable power delivery, and accommodating increased computational power due to the integration of more dies, which leads to space and interconnection complexities.

Innovation Solution

The implementation of a modular structure in die stack packages that includes a substrate, die stacks, an input-and-output extender, and encapsulant, allowing for scalable and efficient electrical coupling of dies through modular units, maintaining a smaller lateral dimension while accommodating multiple dies.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If more dies are integrated into a single package to increase computational power, then processing capability is improved, but signal integrity deteriorates due to increased interconnection complexity

Engineering Contradiction:

Improvecomputational powerVSAvoidsignal integrity

Core Design Contradiction:

PowerVSReliability

Solution Approach 1:

The package is divided into multiple modular units, each containing a subset of dies and their interconnections. This segmentation isolates signal paths within modules, reducing overall interconnection complexity while maintaining high computational power through parallel modular operation.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent transitions from a conventional two-dimensional array layout to a three-dimensional stacked architecture with vertical interconnections. This dimensional change reduces the lateral footprint and shortens signal paths between dies, improving signal integrity while accommodating more dies for enhanced computational power.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Area of stationary object

If more dies are stacked vertically to reduce lateral footprint, then space efficiency is improved, but thermal dissipation becomes more difficult

Engineering Contradiction:

Improvelateral footprintVSAvoidthermal dissipation

Core Design Contradiction:

Area of stationary objectVSTemperature

Solution Approach 1:

The vertical stack is segmented into multiple modular units with intermediate heat dissipation structures. Each module can be independently thermally managed, allowing efficient heat removal from internal dies without increasing lateral footprint.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Heat spreaders and thermal interface materials are introduced as intermediary structures between stacked dies. These intermediaries facilitate thermal conduction across the vertical stack, improving heat dissipation efficiency while maintaining the compact three-dimensional arrangement.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Ease of manufacture

If conventional packaging processes are used to couple bond pads to electrical terminals, then manufacturing simplicity is maintained, but manufacturing precision deteriorates due to high density of small components

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidbond pad coupling precision

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The manufacturing process is segmented into modular assembly steps, with each module pre-assembled and tested before final integration. This segmentation allows conventional processes to be applied to smaller, more manageable units, maintaining manufacturing simplicity while achieving higher precision in bond pad coupling within each module.

Inventive Principle:

Principle #1Segmentation

4Area of stationary object

If dies are densely packed to reduce package size, then space constraints are reduced, but debugging capability deteriorates

Engineering Contradiction:

Improvepackage sizeVSAvoiddebugging capability

Core Design Contradiction:

Area of stationary objectVSDifficulty of detecting and measuring

Solution Approach 1:

The dense die array is organized into discrete modular units with standardized interfaces. This segmentation allows individual modules to be independently accessed, tested, and debugged without requiring disassembly of the entire package, maintaining compact size while improving debugging capability.

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS20260011633A1High die stack package with modular structure

Publication Date: 2026.01.08 MICRON TECHNOLOGY INC

AI summary

Systems, devices, and methods for high die stack packages with modular structures are provided herein. A die stack package can include a substrate, a proximal unit carried by the substrate, and a distal unit carried by the proximal unit. The proximal unit can include first and second proximal die stacks, a proximal portion of a modular structure, and proximal wire bonds electrically coupling the first and second proximal die stacks to conducting elements of the modular structure. The distal unit can include first and second distal die stacks, a distal portion of the modular structure, and distal wire bonds electrically coupling the first and second distal die stacks to the conducting elements of the modular structure. In some embodiments, the die stack package further includes one or more modular units stacked between the proximal unit and the distal unit.