Modular Display Bonding Layer to Hide Black Connection Lines
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Solution Overview
Problem
Large display devices with high resolution face challenges in manufacturing complexity, color uniformity, and visibility of black lines at connection points, along with demands for high color purity and reproducibility.
Innovation Solution
The display device incorporates multiple light emitting modules with signal and common lines, a motherboard, and a bonding layer for electrical connectivity, using conductive materials like anisotropic conductive films or pastes, to facilitate easy assembly and improve color purity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple light emitting modules are assembled to create large display devices, then the display size can be increased, but black lines become visible at connection points between modules
Solution Approach 1:
A bonding layer is introduced as an intermediary component between adjacent light emitting modules. This bonding layer includes a reflective layer that reflects light from light emitting diodes in adjacent modules toward each other, thereby filling in the dark regions at connection points and eliminating visible black lines while maintaining module separation for electrical connectivity
2Reliability
If light emitting modules are connected through solder mount on printed circuit board, then electrical connectivity is achieved, but manufacturing complexity increases for large display devices
Solution Approach 1:
The bonding layer combines multiple functions into a single component: it provides mechanical bonding between modules, establishes electrical connectivity through conductive patterns, and creates light reflection paths. This merges the functions of mechanical attachment, electrical connection, and optical optimization that were previously separate steps in the manufacturing process
3Manufacturing precision
If multiple light emitting modules are assembled to achieve high resolution, then display resolution improves, but color uniformity becomes difficult to match
Solution Approach 1:
The bonding layer creates a homogeneous optical environment across module boundaries by reflecting light uniformly from adjacent modules into the dark regions at connection points. This uniform light reflection helps maintain consistent color characteristics and brightness across the entire display surface, including areas where modules connect
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This structure allows for simple manufacturing of large, high-resolution display devices with improved color reproducibility and reduced visibility of connection points, enhancing overall display quality.
Implementation Method 1
a bonding layer having electrical conductivity and coupling the multiple light emitting modules to the motherboard
Implementation Method 2
using conductive materials like anisotropic conductive films or pastes
Data Source
AI summary
A display device including light emitting modules having signal lines and common lines arranged thereon, each including light emitting diodes mounted on an upper surface thereof and electrically connected to the signal lines and the common lines, respectively, a motherboard coupled to the light emitting modules, and a bonding layer having electrical conductivity and coupling the light emitting modules to the motherboard, in which each of the light emitting modules includes signal line terminals and common line terminals disposed on a lower surface thereof and electrically connected to the signal lines and the multiple common lines, respectively, and the motherboard includes board signal line terminals and board common line terminals disposed on an upper surface thereof at locations corresponding to the signal line terminals and the common line terminals of the light emitting modules.