Modular Display Panel Layout for Variable Pixel Density
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Solution Overview
Problem
Existing display panels require different mold opening processes for varying pixel densities, leading to increased development costs due to the integration of pixel-driving circuits directly into the substrate.
Innovation Solution
The modularization of pixel-driving circuits within a display module, allowing for independent placement on a substrate with separate light-emitting units and terminal groups, which are electrically connected through via holes, enabling flexible placement and reduced manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If pixel-driving circuits are integrated into the substrate, then the display panel structure is compact, but different pixel densities require different mold opening processes increasing development cost
Solution Approach 1:
The pixel-driving circuit is segmented from the substrate and placed as a separate module. This allows the same substrate mold opening process to be used while accommodating different pixel densities by simply changing the pixel unit configuration, not the driving circuit layout.
Solution Approach 2:
A universal substrate mold opening process is designed that can accommodate multiple pixel densities. The pixel-driving circuit module is made adaptable to work with different pixel unit configurations through standardized interface designs and flexible routing.
2Ease of manufacture
If pixel-driving circuits are integrated into the substrate, then the display panel has unified structure, but the development cost increases for different pixel densities
Solution Approach 1:
By separating the pixel-driving circuit from the substrate integration, the manufacturing process is standardized into distinct modules. This segmentation allows reuse of the same substrate process across different pixel density products, reducing development costs.
Solution Approach 2:
The pixel-driving circuit module is designed and tested independently before final assembly. This preliminary development allows standardization to be established once and reused across multiple product variants, reducing overall development expenditure.
3Adaptability or versatility
If pixel-driving circuits are placed separately from substrate, then design freedom increases, but bonding difficulty increases
Solution Approach 1:
The pixel-driving circuit is positioned in a separate spatial dimension (off-substrate) rather than being planarly integrated. This dimensional separation enables flexible placement while maintaining manageable bonding requirements through vertical stacking or side-attachment configurations.
Solution Approach 2:
An intermediary packaging structure is introduced between the substrate and pixel-driving circuit module. This intermediary layer facilitates the bonding process by providing a standardized interface that simplifies connection while allowing design flexibility.
4Productivity
If pixel-driving circuits are integrated into substrate, then assembly is simplified, but assembly efficiency decreases for different pixel densities
Solution Approach 1:
The pixel-driving circuit is segmented into a reusable module that can be pre-assembled and tested independently. This modular approach increases assembly efficiency by allowing the same module to be rapidly deployed across different pixel density configurations without reworking the entire assembly process.
Data Source
AI summary
A display module and a display panel are provided. The display module includes a first substrate, a first pixel-driving circuit module, a light-emitting module, a first packaging structure, and a first terminal module. The first pixel-driving circuit module includes at least one first pixel-driving circuit. The first terminal module includes at least one first terminal group corresponding to the first pixel-driving circuit. The first terminal group is provided with plurality of first via holes. The plurality of first terminals are electrically connected with the first pixel-driving circuit through the plurality of first via holes.