Modular Display Bonding Layer to Hide Seam Black Lines
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Solution Overview
Problem
Large display devices with high resolution face challenges in manufacturing complexity, color uniformity, and visibility of black lines at connection points due to manufacturing tolerances, along with demands for high color purity and reproducibility.
Innovation Solution
A display device design featuring multiple light emitting modules with signal and common lines connected via a bonding layer to a motherboard, utilizing conductive materials like anisotropic conductive films or pastes, and wire bonding for electrical connections, facilitating easy assembly and improved color reproduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple light emitting modules are connected via solder mount on printed circuit board, then electrical connection is achieved, but black lines become visible at connection points due to manufacturing tolerances
Solution Approach 1:
The patent introduces a bonding layer as an intermediary between the light emitting modules and the printed circuit board. This bonding layer compensates for manufacturing tolerances and installation variations, preventing the formation of visible black lines at connection points while maintaining reliable electrical connection through the solder mount process.
2Ease of manufacture
If light emitting modules are arranged at constant intervals on printed circuit board, then assembly is facilitated, but color uniformity and white balance matching become difficult
Solution Approach 1:
The patent adjusts the bonding parameters (bonding pressure, bonding temperature, bonding area) of the bonding layer to compensate for variations in module positioning. By optimizing these bonding parameters, the patent achieves both easy assembly at constant intervals and improved color uniformity across the display device.
3Area of stationary object
If large size display device is manufactured using traditional methods, then display area is increased, but manufacturing time becomes excessively long
Solution Approach 1:
The patent divides the large display device into multiple light emitting modules that can be independently manufactured and then assembled using the bonding layer. This segmentation allows parallel manufacturing of modules, significantly reducing the overall manufacturing time while achieving large display areas through modular assembly.
4Reliability
If traditional wire bonding and solder mount processes are used, then electrical connection is established, but manufacturing complexity increases
Solution Approach 1:
The patent combines the wire bonding and solder mount processes into a single integrated bonding layer application. The bonding layer simultaneously provides both the wire bonding function (electrical connection) and the solder mount function (mechanical attachment), thereby reducing manufacturing process complexity while maintaining reliable electrical connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables simple manufacturing of large, high-resolution display devices with enhanced color purity and reproducibility, reducing visible connection points and improving manufacturing efficiency.
Implementation Method 1
a bonding layer having electrical conductivity and coupling the multiple light emitting modules to the motherboard
Implementation Method 2
utilizing conductive materials like anisotropic conductive films or pastes
Data Source
AI summary
A display device including light emitting modules having signal lines and common lines arranged thereon, each including light emitting diodes mounted on an upper surface thereof and electrically connected to the signal lines and the common lines, respectively, a motherboard coupled to the light emitting modules, and a bonding layer having electrical conductivity and coupling the light emitting modules to the motherboard, in which each of the light emitting modules includes signal line terminals and common line terminals disposed on a lower surface thereof and electrically connected to the signal lines and the multiple common lines, respectively, and the motherboard includes board signal line terminals and board common line terminals disposed on an upper surface thereof at locations corresponding to the signal line terminals and the common line terminals of the light emitting modules.