Modular Display Unit Interconnect for Easier Large-Screen Repair

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Solution Overview

Problem

The manufacturing cost of large-sized display apparatus is high due to the jointing of multiple display devices, and repairing such apparatus is inconvenient when one display device is damaged.

Innovation Solution

The electronic device includes a substrate with through holes and bumps, allowing for flexible connection and independent repair of individual display units through microstructures and engaging mechanisms, reducing stress and facilitating easy assembly and disassembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If multiple display devices are jointed to form large-sized display apparatus, then the display size is increased, but the manufacturing cost increases and repair convenience deteriorates

Engineering Contradiction:
Improvedisplay sizeVSAvoidrepair convenience
Core Design Contradiction:
Area of stationary objectVSEase of repair

Solution Approach 1:

The display apparatus is divided into multiple independently replaceable display devices that can be jointed together to form a large-sized display. Each display device functions as an independent module with its own substrate, bumps, and electronic elements, allowing individual replacement without affecting other modules.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

When one display device is damaged, only the damaged module needs to be replaced while the undamaged display devices can be recovered and reused. This reduces waste and lowers the overall cost of repair for the large-sized display apparatus.

Inventive Principle:
Principle #34Discarding and recovering

2Area of stationary object

If multiple display devices are jointed to form large-sized display apparatus, then the display size is increased, but the manufacturing cost increases

Engineering Contradiction:
Improvedisplay sizeVSAvoidmanufacturing cost
Core Design Contradiction:
Area of stationary objectVSEase of manufacture

Solution Approach 1:

The display is segmented into multiple standard-sized display devices that can be manufactured using conventional production processes, avoiding the need for expensive custom manufacturing of large-sized displays. The modular approach allows for economies of scale in producing each individual display device.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The modular design allows undamaged display devices to be recovered and reused when only one module is damaged, reducing the overall manufacturing cost by minimizing the number of devices that need to be replaced or manufactured.

Inventive Principle:
Principle #34Discarding and recovering

3Area of stationary object

If display devices are jointed together, then large-sized display is achieved, but the complexity of the system increases

Engineering Contradiction:
Improvedisplay sizeVSAvoidsystem complexity
Core Design Contradiction:
Area of stationary objectVSDevice complexity

Solution Approach 1:

The system is segmented into identical or standardized display device modules, each with the same internal structure (substrate, bumps, electronic elements). This standardization reduces system complexity by allowing the use of the same manufacturing processes, connection methods, and replacement procedures for each module.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Multiple standardized display device modules are merged together through bump connections to form a large-sized display. The merging process uses uniform connection mechanisms and alignment methods, which simplifies the overall system integration compared to creating a single large display from scratch.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS12518658B2Electronic device
Publication Date: 2026.01.06 INNOLUX CORP
  • US12518658B2 patent drawing
  • US12518658B2 patent drawing
  • US12518658B2 patent drawing

AI summary

An electronic device is provided and includes a substrate, a first bump, a second bump, and an electronic element. The substrate includes a first through hole and a second through hole disposed adjacent to the first through hole along a direction. The first bump and the second bump are overlapped with the substrate, wherein the first bump is adjacent to the second bump along the direction. The electronic element is overlapped with the substrate and electrically connected to the first bump, wherein the substrate is disposed between the first bump and the electronic element. A distance between the first through hole and the second through hole of the substrate along the direction is different from a distance between the first bump and the second bump along the direction.