Modular Domain Computer Housing for Automotive Heat and Vibration

The system segments electronic units into modular components that can be independently tested and qualified. Each electronic unit is designed as a separate module with standardized interfaces, allowing individual testing without requiring complete system integration for qualification. This enables faster market availability while maintaining reliability through targeted testing of critical functions.

The patent implements universal test and qualification procedures that can accommodate multiple types of electronic units with different functionalities. The standardized testing framework applies to various electronic components (sensors, actuators, control units) regardless of their specific function, reducing the need for separate qualification processes for each innovative technology while ensuring comprehensive coverage of safety-critical aspects.

The patent introduces standardized mechanical and electrical interfaces as intermediaries between non-automotive electronic components and the automotive environment. These interfaces include standardized mounting structures, electrical connectors, and thermal management interfaces that mediate the interaction between consumer electronics and automotive conditions (vibration, temperature, humidity), enabling reliable operation without requiring components to be originally designed for automotive use.

The system employs parameter-based qualification approaches where electronic components are tested under varied environmental parameters (temperature ranges, vibration levels, humidity conditions) to determine their operational limits. By establishing performance thresholds and operating envelopes, the system can accommodate diverse electronic components with different inherent characteristics while ensuring they meet automotive reliability requirements through documented performance verification.

The patent divides the electronic system into segmented modules with standardized interfaces. Each electronic unit is a self-contained module with defined mechanical, electrical, and thermal interfaces. This segmentation reduces integration complexity by providing clear boundaries and standardized connection points, while maintaining configuration flexibility through the ability to selectively assemble different module combinations based on application requirements.

The system implements universal standardized interfaces that work across all electronic unit types. Mechanical mounting interfaces, electrical connectors, and thermal management connections are standardized to enable any electronic unit to be integrated into any appropriate location in the system. This universality simplifies integration procedures while preserving design flexibility, as engineers can freely configure system architecture by selecting and combining standardized modules.