Modular Double Floor Cooling Circuit for Data Center Heat Management
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Solution Overview
Problem
Existing data center cooling systems are inefficient and difficult to upgrade, leading to high energy consumption and increased costs due to the need for individual planning and resource-intensive expansions.
Innovation Solution
A cooling circuit arrangement where heat exchangers are housed in the double floor elements, allowing for efficient operation of fans at low power and enabling intelligent airflow management, with a focus on minimizing pressure losses and optimizing space utilization by separating hot and cold air streams.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If individual planning is used for data center cooling systems, then the system can be customized to specific requirements, but energy efficiency is reduced and costs increase
Solution Approach 1:
The cooling system is divided into modular cooling circuit arrangements that can be independently configured and combined. Each module handles specific thermal loads, allowing standardized efficient components to be replicated and adapted to different data center sizes and requirements without custom design, thereby maintaining energy efficiency while providing customization through modular assembly.
2Productivity
If existing data centers are expanded to increase computing capacity, then more computing power is available, but the expansion is resource intensive and time-consuming
Solution Approach 1:
The cooling system is designed as modular units that can be independently deployed and connected. When expanding computing capacity, additional modular cooling circuits can be quickly installed and integrated without redesigning the entire system, enabling rapid scaling of both computing and cooling infrastructure.
Solution Approach 2:
The modular cooling circuit arrangements are designed with universal interfaces and standardized components that can serve multiple configurations and scales. The same basic module design can accommodate different heat loads and be deployed in various data center environments, reducing the time and resources needed for expansion planning and implementation.
3Reliability
If fans are operated at high power to ensure adequate cooling, then cooling performance is improved, but energy consumption increases
Solution Approach 1:
The system replaces purely mechanical fan-based air cooling with a hybrid approach that uses liquid-to-air heat exchangers for primary cooling. This substitution of mechanical airflow generation with thermodynamic heat transfer reduces the energy required for cooling while maintaining or improving cooling performance, as liquid heat exchangers are more efficient at transferring thermal energy than air-moving fans.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances energy efficiency, reduces operational costs, and facilitates easy scalability and maintenance by allowing for parallel fan operation and reduced air volume circulation, thereby improving overall cooling performance and reducing the need for complex humidification and dehumidification systems.
Implementation Method 1
at least one heat exchanger (404), in particular a liquid-to-air heat exchanger, is housed in one or more double floor elements (320, 322, 324, 326, 328)
Data Source
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AI summary
The invention relates to a cooling circuit system comprising a plurality of juxtaposed racks (30; 302, 304, 306); a double bottom consisting of double bottom elements (32; 320, 322, 324, 326, 328; 402, 406) mounted on a base bottom (300), on which double bottom the racks (30; 302, 304, 306) are mounted; electric or electronic components to be cooled, which components are accommodated in the racks (30; 302, 304, 306); and a cooling system, the components of which are accommodated in the double bottom. The cooling system comprises blowers (408) that are connected in parallel and that blow cooled air from the double bottom towards the juxtaposed racks (30; 302, 304, 306). The invention further relates to a method for controlling said cooling circuit system.