Modular Direct Radiating Array Assembly With Passive Thermal Blades

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Solution Overview

Problem

Existing direct radiating array (DRA) antennas face challenges in managing size, mass, and power, particularly in spaceborne applications where weight constraints limit the number of radiating elements and electrical efficiency. Additionally, increasing frequency bands and the need for multiple beams complicate the integration of mechanical and electrical components close to the array, especially in Low Earth Orbit (LEO) applications. Heat management is also a concern, as signal amplifiers generate heat that can reduce antenna efficiency if not properly dissipated.

Innovation Solution

The proposed DRA antenna design includes a plurality of radiating elements and RF signal chain paths, each coupled to a respective radiating element for signal amplification. A single beamforming network board connects to the RF signal chain paths, and a heat spreader or thermal blades are used to passively cool heat-generating components. The antenna is modular, with radiating element modules and SIP modules mounted to the beamforming network board, and thermal blades are arranged perpendicular to the board to efficiently transfer heat.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the number of radiating elements is increased to improve antenna performance, then electrical efficiency is improved, but weight increases which exceeds allocation constraints

Engineering Contradiction:
Improveelectrical efficiencyVSAvoidantenna weight
Core Design Contradiction:
ReliabilityVSWeight of moving object

Solution Approach 1:

The antenna is divided into modular radiating element assemblies, each containing a subset of radiating elements and their associated RF signal chain paths. These modules can be selectively configured to meet weight constraints while maintaining required electrical efficiency through optimized distribution of active elements.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The beamforming network board serves multiple functions: it provides electrical interconnection for RF signal chain paths, supports modular radiating element assemblies, and integrates heat dissipation structures. This multi-functionality reduces the need for separate components, thereby reducing overall weight while maintaining performance.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Loss of energy

If mechanical and electrical components are concentrated close to the array to reduce signal path length, then signal loss is reduced, but device complexity increases due to integration challenges

Engineering Contradiction:
Improvesignal lossVSAvoidintegration complexity
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The beamforming network board merges multiple functions into a single structure: RF signal distribution, mechanical support for radiating element modules, and thermal management integration. This consolidation reduces the number of discrete components and simplifies integration while keeping signal paths short.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent utilizes three-dimensional spatial arrangement by mounting radiating element modules vertically above the beamforming network board and arranging thermal blades perpendicular to the board. This vertical stacking in the Z-dimension allows compact integration with short signal paths while managing heat dissipation in multiple directions.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Temperature

If heat dissipation structures are added to manage heat from signal amplifiers, then temperature control is improved, but weight increases

Engineering Contradiction:
Improveheat dissipationVSAvoidantenna weight
Core Design Contradiction:
TemperatureVSWeight of moving object

Solution Approach 1:

Heat dissipation structures (thermal blades and heat sinks) are integrated with the beamforming network board and radiating element assemblies rather than being separate components. The thermal blades are mounted perpendicular to the board and work in conjunction with the existing structural elements, eliminating the need for additional weight-bearing heat dissipation structures.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

Heat management is implemented locally at the source by attaching thermal blades directly to heat-generating components (signal amplifiers and RF signal chain paths). This localized approach targets only the critical heat sources rather than requiring a comprehensive heat dissipation system for the entire antenna, thereby minimizing added weight.

Inventive Principle:
Principle #3Local quality

4Adaptability or versatility

If radiating element modules are arranged with narrow spacing for LEO applications, then beam scanning capability is improved, but device complexity increases due to component concentration

Engineering Contradiction:
Improvebeam scanning capabilityVSAvoidcomponent concentration
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The antenna array is segmented into multiple independent radiating element modules that can be selectively activated. This segmentation allows narrow spacing between modules for LEO beam scanning while managing complexity by controlling the number of active modules based on operational requirements rather than requiring all components to be fully integrated and operational simultaneously.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design reduces the size, mass, and power consumption of the DRA antenna while maintaining high electrical efficiency. The modular structure and effective heat management system ensure that the antenna performs well in constrained spaceborne environments, particularly in LEO where component proximity and heat dissipation are critical issues.

Implementation Method 1

a heat spreader adapted to passively cool the DRA antenna by transferring heat generated by the heat generating component of the RF signal chain path to a heat sink

Methodology Applied
Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 2

a plurality of thermal blades for passively transferring heat generated by the heat generating component mounted thereto

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

Each of the plurality of thermal blades may include a heat pipe adapted to actively or passively transfer heat. The heat pipe may be an oscillating heat pipe adapted to passively transfer heat

Methodology Applied
Scientific EffectPhase change: Phase Change

Data Source

PatentUS12266844B2Direct radiating array assembly of an antenna
Publication Date: 2025.04.01 MACDONALD DETTWILER & ASSOC INC
  • US12266844B2 patent drawing
  • US12266844B2 patent drawing
  • US12266844B2 patent drawing

AI summary

Increasing demand for communications systems for facilitating communications such as communications satellites leads to continuously increasing frequency bands of the signal for communication and the quantity of beams carrying the signals may make it more and more difficult to have a significant number of mechanical and electrical components concentrated in a location in proximity to the array while maintaining antenna efficiency. Provided is a direct radiating array (“DRA”) antenna for transmitting or receiving an electromagnetic radio frequency (“RF”) signal of at least one predetermined signal frequency band and a method of assembly that overcomes at least some of the disadvantages of existing direct radiating array systems and methods. The DRA antenna comprising a plurality of radiating elements, a plurality of RF signal chain paths and a beamforming network board having a plurality of electrical ports for electrically connecting to the plurality of RF signal chain paths.