Modular Carrier for E1.S Storage Devices
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Solution Overview
Problem
Current server designs require different carriers for various E1.S form factors due to their distinct shapes and thicknesses, leading to inflexibility and increased costs for component swapping in data centers.
Innovation Solution
A modular carrier system that includes a base, bezel, and cover, allowing for the attachment and swapping of different E1.S form factors without the need for tools, and enabling efficient insertion into server slots.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If different carriers are used for various E1.S form factors, then each form factor can be properly accommodated, but device complexity and cost increase
Solution Approach 1:
The patent implements a universal carrier design where a single carrier body can accommodate multiple E1.S form factors (110, 120, 140, 150) through interchangeable adapter components. The carrier includes a standardized base structure with mounting features that accept different form factor devices, eliminating the need for multiple specialized carriers and reducing overall system complexity.
Solution Approach 2:
The carrier system is divided into modular segments: a universal carrier body and separate form-factor-specific adapters or enclosures. This segmentation allows the common carrier infrastructure to remain unchanged while only the adapter portion needs to be swapped when changing form factors, simplifying the overall carrier management.
2Adaptability or versatility
If different carriers are used for various E1.S form factors, then each form factor can be properly accommodated, but cost increases
Solution Approach 1:
By designing a universal carrier body that serves all E1.S form factors, the patent reduces manufacturing costs through economies of scale. The common carrier infrastructure can be mass-produced once, and only the relatively simple adapter components need to be manufactured in smaller quantities for different form factors, significantly reducing total manufacturing expenditure.
Solution Approach 2:
The patent merges the functionality of multiple specialized carriers into a single universal carrier system. This consolidation eliminates redundant manufacturing of multiple carrier types, reducing material waste, tooling costs, and assembly complexity while maintaining the ability to support all E1.S form factors.
3Reliability
If tools are required for carrier installation, then secure attachment is achieved, but operational efficiency decreases
Solution Approach 1:
The carrier system incorporates self-latching mechanisms and snap-fit features that automatically secure form factor devices to the carrier body without requiring external tools. The design includes elastic retention elements and mechanical interlocks that engage automatically during insertion, providing reliable attachment while enabling tool-free installation and removal for rapid operational efficiency.
Data Source
AI summary
A carrier for different form factors for insertion in a slot of a computing device is disclosed. The different form factors have different thicknesses defined by the E1.S specification. The carrier includes a base holding a first type of form factor. A bezel is configurable for insertion in a slot for a device of the first type of form factor. The bezel has an attachment surface. The base is attachable to the attachment surface of the bezel. A second type of form factor is also attachable to the attachment surface of the bezel. A cover encloses the first type of form factor when joined to the base. The base and cover are discarded when the second type of form factor is attached to the bezel. The attached bezel and second type of form factor may also be inserted in the slot.