Modular Electrical Device with Memory Element for Rapid Fieldbus Commissioning

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Solution Overview

Problem

Existing electrical devices face challenges in simple and cost-effective maintenance and commissioning, particularly in quickly reconfiguring fieldbus parameters and replacing defective modules without disrupting the fieldbus system.

Innovation Solution

The electrical device is designed with modular components, where each module has an electronic circuit on a heat sink, allowing for rapid replacement and commissioning by reading out and reusing original fieldbus parameters, and utilizing a memory element for storing and retrieving subscriber addresses and other parameters through a plug-in connection, enabling seamless integration into the system bus.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of repair

If electrical devices are replaced including the lower part with electronic circuit, then maintenance and commissioning can be performed, but rapid commissioning is difficult because new fieldbus parameters must be configured manually

Engineering Contradiction:
Improvemaintenance and commissioningVSAvoidcommissioning time
Core Design Contradiction:
Ease of repairVSLoss of time

Solution Approach 1:

The memory element stores fieldbus parameters (subscriber address, baud rate, etc.) in advance before the electrical device is replaced. When the new electrical device is installed, these pre-stored parameters are automatically read out and activated, eliminating the need for manual reconfiguration and enabling rapid commissioning.

Inventive Principle:
Principle #10Preliminary action

2Weight of stationary object

If electrical devices are made compact with heat sink, then mass is reduced making exchange easier, but heat dissipation requirements increase

Engineering Contradiction:
ImprovemassVSAvoidheat dissipation
Core Design Contradiction:
Weight of stationary objectVSTemperature

Solution Approach 1:

The heat sink utilizes phase transition of heat transfer media (such as convection currents in air or liquid coolants) to efficiently dissipate heat from the compact electrical device. This allows the device to maintain small mass while effectively managing thermal load through phase change-based heat transfer mechanisms.

Inventive Principle:
Principle #36Phase transitions

3Ease of repair

If modular design is implemented with upper and lower parts, then defective modules can be replaced rapidly, but device complexity increases

Engineering Contradiction:
Improvemodule replacementVSAvoidstructural complexity
Core Design Contradiction:
Ease of repairVSDevice complexity

Solution Approach 1:

The electrical device is divided into modular components (upper part with memory element and lower part with electronic circuit). This segmentation allows defective modules to be independently replaced without affecting other components, enabling rapid maintenance while the standardized modular interface keeps the overall system manageable.

Inventive Principle:
Principle #1Segmentation

4Reliability

If memory element is designed as mechanical version (DIP switch), then memory is stable and robust, but data storage capacity is limited

Engineering Contradiction:
Improvememory stabilityVSAvoiddata storage capacity
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

The patent allows flexible selection between mechanical memory elements (DIP switches) for high reliability and electronic memory elements for increased data storage capacity. This parameter change enables the system to be optimized based on specific application requirements, balancing reliability and storage needs.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentEP2491772B1Electrical device
Publication Date: 2017.04.05 SEW EURODRIVE GMBH & CO KG
  • EP2491772B1 patent drawing
  • EP2491772B1 patent drawing
  • EP2491772B1 patent drawing

AI summary

The invention relates to an electrical device, which is composed of modules or comprises combined modules, wherein the modules each comprise an electronic circuit, the electronic circuits each being placed on a respective heat sink, wherein modules are designed as nodes of a system bus, which is also guided to an electronic circuit implemented as a node of the system bus, wherein the electronic circuit is arranged in a lower part, which is arranged in a recess of the housing of the electrical device, wherein an upper part can be detachably connected to the lower part, wherein a memory element is arranged in the upper part and data lines for reading out the memory element by means of the electronic circuit are guided to the electronic circuit by means of a plug-in connection.