Modular Electrical Device Skeleton Frame Cooling
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Solution Overview
Problem
Modular electrical devices face challenges in optimizing cooling structures due to limited space and reduced effectiveness of passive ventilation methods, leading to inadequate heat dissipation for multiple heat-emitting components.
Innovation Solution
The electrical device employs a skeleton-like frame structure with columns and crossbeams for improved airflow and incorporates liquid cooling with a radiator, allowing efficient heat dissipation through an active ventilation system, reducing the need for direct airflow between modules and enabling flexible module arrangement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If passive ventilation is used for cooling modular electrical devices, then the structure is simple and weight is reduced, but cooling performance is insufficient for multiple heat-emitting components
Solution Approach 1:
The cooling system is segmented into multiple independent cooling channels, with each channel equipped with its own fan and heat sink assembly. This allows each module to be cooled independently, improving overall cooling performance while maintaining modular simplicity
Solution Approach 2:
Heat pipes are introduced as intermediary elements between the heat-emitting components and the heat sinks. They efficiently transfer heat from compact modules to larger dissipation surfaces, enhancing cooling capability without increasing structural complexity
2Temperature
If direct airflow between modules is implemented, then cooling effectiveness improves, but module arrangement flexibility is reduced
Solution Approach 1:
The airflow path is extracted from the inter-module spaces and redirected through dedicated cooling channels on the rear panel. This separates the cooling function from the module arrangement, allowing modules to be positioned flexibly while maintaining effective heat dissipation through independent cooling paths
Solution Approach 2:
The cooling system transitions from two-dimensional airflow between adjacent modules to three-dimensional cooling channels on the rear panel surface. This dimensional shift allows heat dissipation to occur perpendicular to the module arrangement plane, decoupling cooling effectiveness from horizontal module positioning
3Adaptability or versatility
If modular structure is used for customization, then customer requirements are satisfied and design freedom increases, but optimization of cooling structure becomes difficult
Solution Approach 1:
A universal cooling backbone structure is implemented on the rear panel with standardized cooling channels and mounting interfaces. This universal framework can accommodate different module configurations and customer customizations while maintaining optimized cooling performance through consistent thermal management architecture
Solution Approach 2:
The cooling channels and heat dissipation structures are pre-configured in the rear panel during manufacturing, before module installation. This preliminary setup ensures optimal thermal pathways are established in advance, allowing modules to be customized and installed without compromising cooling optimization
4Weight of stationary object
If skeleton-like frame structure is used, then weight is reduced and design freedom increases, but structural rigidity may be compromised
Solution Approach 1:
The skeleton-like frame structure utilizes composite materials with high strength-to-weight ratios, combining lightweight properties with sufficient structural rigidity to support modular components while maintaining overall device strength
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances cooling performance, increases design freedom, and reduces weight while maintaining rigidity, ensuring effective heat management and protection of electrical components.
Implementation Method 1
the radiator and an active ventilation means are mounted on the electrical device such that the radiator is positioned in an airstream generated by the active ventilation means
Implementation Method 2
liquid cooling with a radiator, allowing efficient heat dissipation through an active ventilation system
Implementation Method 3
the radiator is positioned in an airstream generated by the active ventilation means
Data Source
AI summary
An electrical device including a skeleton-like frame structure and at least one electrical module is provided. The skeleton-like frame structure has a low rigidity, while the at least one electrical module provides an increased rigidity when mounted.