Modular Electron Beam Scanning for Faster Substrate Processing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electron beam processing methods for substrates, such as semiconductor wafers, are time-consuming and costly, necessitating more efficient and cost-effective techniques for concurrent processing.
Innovation Solution
Utilizing a processing tool with multiple independently powered and controlled modular electron beam devices that concurrently direct electron beams to different areas of a substrate while moving at varying velocities and power levels to optimize processing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electron beam lithography is used to process an entire workpiece, then highly customized variations on the substrate can be enabled, but processing time becomes prohibitively long
Solution Approach 1:
The substrate processing area is divided into multiple discrete regions, with each region processed by a separate electron beam device. This allows parallel processing of different areas simultaneously, dramatically reducing total processing time while maintaining the ability to customize each region independently with different beam parameters and patterns.
2Manufacturing precision
If a single electron beam device processes the substrate sequentially, then precise control is achieved, but processing efficiency is reduced
Solution Approach 1:
Multiple independent electron beam devices are merged into a single processing tool, allowing concurrent processing of different substrate areas. Each beam device maintains its own independent control system for precise beam manipulation, while the combined system achieves high throughput through parallel operation of multiple beams on the same substrate.
3Ease of operation
If the substrate is moved at constant velocity during scanning, then processing simplicity is maintained, but processing time for different areas cannot be optimized
Solution Approach 1:
The substrate stage velocity is made dynamically adjustable during the scanning process. Different velocity settings can be applied during different scan passes or different areas of the substrate, allowing optimization of processing time for various regions while maintaining precise beam control and processing quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables faster and more efficient processing of substrates by allowing concurrent processing of different areas with precise control over beam power and movement, enhancing throughput and reducing processing time.
Implementation Method 1
concurrently directing a plurality of electron beams from the plurality of electron beam devices to the substrate to process different areas of the substrate concurrently
Data Source
AI summary
A method for electron beam processing is described herein. A method includes disposing a substrate on a stage of a processing tool comprising a plurality of independently powered, independently controlled modular electron beam devices, concurrently directing a plurality of electron beams from the plurality of electron beam devices to the substrate to process different areas of the substrate concurrently, and, while directing the electron beams to the substrate, moving the substrate at a first constant velocity during a first scan pass and at a second constant velocity during a second scan pass, the first constant velocity being different from the second constant velocity.