Modular Electronic Device Thermal Management for Aeronautics
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Solution Overview
Problem
In electronic devices operating in severe environments, such as small and non-pressurized aircraft, the degradation of electronic equipment due to impurities in the heat transfer fluid poses a challenge, and existing solutions like sealing the fluid in an electronic equipment box lead to insufficient heat dissipation or increased weight.
Innovation Solution
An electronic device with a cover integral to the radiator and printed circuit board forms a channel for heat transfer fluid circulation, using deformable seals to prevent contact with electronic components, enhancing heat dissipation efficiency and reducing weight by eliminating the need for heat sinks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the heat transfer fluid is sealed in an electronic equipment box, then the electronic equipment is protected from corrosive impurities, but the heat dissipation efficiency deteriorates and weight increases
Solution Approach 1:
The electronic equipment box is divided into separate functional zones: a sealed compartment for protecting electronic components from corrosive heat transfer fluid, and an open compartment for heat dissipation. This segmentation allows the system to simultaneously achieve protection and weight reduction by eliminating the need for heavy heat sinks in the open compartment.
Solution Approach 2:
The heat dissipation function is extracted from the sealed enclosure and placed in an open compartment. This allows the sealed compartment to focus solely on protection while the open compartment handles heat dissipation through natural convection, eliminating the need for heavy heat sinks and reducing overall weight.
2Reliability
If the heat transfer fluid is sealed in an electronic equipment box, then the electronic equipment is protected from corrosive impurities, but the heat dissipation efficiency deteriorates
Solution Approach 1:
The electronic equipment box is divided into separate functional zones: a sealed compartment for protecting electronic components from corrosive heat transfer fluid, and an open compartment for heat dissipation. This segmentation allows the system to simultaneously achieve protection and weight reduction by eliminating the need for heavy heat sinks in the open compartment.
Solution Approach 2:
The heat dissipation function is extracted from the sealed enclosure and placed in an open compartment. This allows the sealed compartment to focus solely on protection while the open compartment handles heat dissipation through natural convection, eliminating the need for heavy heat sinks and reducing overall weight.
3Temperature
If heat sinks are used to conduct heat dissipated from printed circuit boards to the enclosure walls, then heat dissipation is achieved, but the weight and volume increase significantly
Solution Approach 1:
The heat dissipation function is extracted from the sealed enclosure and placed in an open compartment. This allows the sealed compartment to focus solely on protection while the open compartment handles heat dissipation through natural convection, eliminating the need for heavy heat sinks and reducing overall weight.
Solution Approach 2:
Instead of using heavy heat sinks to conduct heat to enclosure walls, the invention inverts the approach by using natural convection in an open compartment to directly dissipate heat from the electronic components. This eliminates the need for intermediate heat conduction structures and significantly reduces weight.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves heat dissipation efficiency, reduces weight, and maintains compatibility with aeronautical standards, ensuring effective heat balance without the bulk and mass issues associated with traditional heat sinks.
Implementation Method 1
a radiator, a first face of which is in contact with electronic components of a first face of the printed circuit board and a second face of which is shaped to evacuate the heat by convection
Implementation Method 2
a forced movement of heat transfer fluid, such as for example air, close to electronic equipment serves to evacuate the heat that the electronic equipment dissipates
Data Source
Figure 1
Figure 2a
Figure 2b
AI summary
The invention concerns an electronic device operating in difficult environments. The electronic device comprises at least one printed circuit board (1) supporting electronic heat-dissipating components, a radiator (5) having a first surface (51) in contact with the electronic components of a first surface (111) of the printed circuit board (1) and having a second surface (52) configured to evacuate heat by convection. The invention is characterized in that it further comprises a cover (10) delimiting a channel (4) wherein flows a coolant (20) providing convection, the cover (10) being secured to the radiator (5) and to the printed circuit board (1), and in that the channel (4) prevents the coolant (20) from coming into contact with the electronic components.