Modular Electronic Housing Bonding for Component Adaptation

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Solution Overview

Problem

Modular electronic housings face challenges in securely and flexibly accommodating various electronic components without requiring modifications to the housing series body, limiting their adaptability and application range.

Innovation Solution

A modular electronic housing design featuring a maintaining device with a holding body materially bonded to the housing series body, allowing for flexible configuration and adaptation via bonding methods such as welding, adhesives, or a combination of both, using positioning elements for precise placement and various materials for cost-effective and secure component retention.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the housing series body is designed with a maintaining device for securing electronic components, then the reliability of component retention is improved, but the adaptability to different electronic components deteriorates

Engineering Contradiction:
Improvecomponent retention securityVSAvoidadaptability to different electronic components
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The maintaining device is segmented into a housing series body and a separate holding body. The holding body can be materially bonded to the housing series body in a bonding position, allowing the maintaining device to be adapted for different electronic components without modifying the housing series body itself. This segmentation enables flexibility while maintaining reliable component retention.

Inventive Principle:
Principle #1Segmentation

2Adaptability or versatility

If the housing series body is modified to accommodate different electronic components, then the adaptability is improved, but the ease of manufacture deteriorates

Engineering Contradiction:
Improveconfiguration flexibilityVSAvoidhousing production simplicity
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The adaptability features are extracted from the housing series body and placed in a separate holding body. The holding body is designed to be materially bonded to the housing series body in a bonding position, allowing different configurations to be achieved by changing or repositioning the holding body rather than modifying the housing series body itself. This maintains ease of manufacture while achieving configuration flexibility.

Inventive Principle:
Principle #2Taking out (Extraction)

3Adaptability or versatility

If multiple maintaining devices are provided for different electronic components, then the versatility is improved, but the device complexity deteriorates

Engineering Contradiction:
Improvecomponent accommodation varietyVSAvoidmaintaining device structure
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The holding body is designed as a universal maintaining device that can accommodate different electronic components. By materially bonding the holding body to the housing series body in a bonding position, a single maintaining device structure can serve multiple functions for different components, reducing the need for multiple specialized maintaining devices and thereby simplifying the overall device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables late-stage configuration of modular electronic housings with flexible adaptation to different components, covering a wide range of applications cost-effectively and efficiently, with secure bonding and easy repositioning capabilities, suitable for both mass production and small batches.

Implementation Method 1

bonding methods such as welding, adhesives, or a combination of both

Methodology Applied
Scientific EffectWelding: Welding

Implementation Method 2

bonding methods such as welding, adhesives, or a combination of both

Methodology Applied
Scientific EffectAdhesive bonding: Adhesive

Data Source

PatentUS11197381B2Modular electronic housing for housing electronic components and a method for producing the same
Publication Date: 2021.12.07 PHOENIX CONTACT GMBH & CO KG
  • US11197381B2 patent drawing
  • US11197381B2 patent drawing
  • US11197381B2 patent drawing

AI summary

A modular electronic housing includes: a housing series body whose receiving chamber houses an electronic component; and a maintaining device for maintaining the electronic component on the housing series body, the maintaining device having at least one holding body for the electronic component, which holding body is materially bonded to the housing series body in a bonding position.