Modular Electronic Load Heat-Dissipating Fins
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Solution Overview
Problem
Existing electronic load devices with a common heat-dissipating structure for higher power models result in resource wastage and increased size for lower power models, as the structure is over-satisfying the demand and inefficiently uses energy.
Innovation Solution
An electronic load device with modular load modules, featuring a main board and a heat-dissipating unit with spirally shaped fins, allowing for independent assembly of load modules based on power demands, reducing energy consumption and avoiding large heat-dissipating structures in low-load models.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a common heat-dissipating structure designed for high power models is used across all models in a series, then part commonality is improved and manufacturing cost is reduced, but lower power models suffer from resource wastage and excessive size
Solution Approach 1:
The heat-dissipating structure is segmented into modular load modules, where each module contains a specific number of power components (1, 2, or 3) and corresponding heat-dissipating fins. This allows the system to be configured according to actual power requirements rather than using a fixed oversized structure for all models.
Solution Approach 2:
The system transitions from a static, fixed heat-dissipating structure to a dynamic, reconfigurable modular system. Load modules can be selectively assembled or disassembled based on the required power level, enabling the heat-dissipating capacity to adapt to actual operational demands.
2Ease of manufacture
If a common heat-dissipating structure designed for high power models is used across all models in a series, then part commonality is improved and manufacturing cost is reduced, but the occupation and weight of lower power models become irreducible
Solution Approach 1:
By dividing the heat-dissipating structure into separate modular load modules, each module's weight can be optimized for its specific power level. Lower power models only include the necessary modules, reducing overall device weight compared to a fixed high-power configuration.
Solution Approach 2:
Each load module is designed with local quality optimization, where the heat-dissipating fins and power components are sized appropriately for that module's power rating. This ensures that each local component is neither oversized nor undersized, optimizing the overall weight distribution.
3Ease of manufacture
If a common heat-dissipating structure designed for high power models is used across all models in a series, then part commonality is improved, but energy resources are wasted for excessive heat dissipation capacity
Solution Approach 1:
The modular design enables dynamic adjustment of heat-dissipating capacity to match actual power consumption requirements. Lower power models consume less energy for heat dissipation by using fewer and smaller heat-dissipating fins, rather than continuously operating an oversized heat-dissipating structure.
Solution Approach 2:
The system changes the parameter of heat-dissipating capacity by selecting different combinations of load modules. Each module's heat-dissipating fin size and quantity are optimized for its power level, allowing the overall system to operate at efficient energy levels for each specific model.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This modular design allows for reduced energy consumption and eliminates the need for excessive heat-dissipating structures in low-load models, optimizing resource usage and cost-effectiveness while accommodating various load powers.
Implementation Method 1
heat-dissipating unit with a cylindrical body and a plurality of heat-dissipating fins
Implementation Method 2
heat-dissipating fins is connected with the outer surface
Data Source
AI summary
An electronic load device includes a main board and a load module. The main board has a plurality of first connecting ports. The load module includes a sub board and a heat-dissipating unit. The sub board has a second connecting port and a pin-hole port. The second connecting port is used for detachably connecting one of the plurality of first connecting ports. The pin-hole port is used for connecting a power component. The heat-dissipating unit has a cylindrical body and a plurality of heat-dissipating fins. The cylindrical body is defined with an outer surface and an inner surface opposite to the outer surface. The plurality of heat-dissipating fins is connected with the outer surface. When the power component is connected to the pin-hole port, the power component contacts the inner surface.