Modular Electronic Prototyping Platforms for Reliable Iteration

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Solution Overview

Problem

Electronics prototyping platforms face challenges in transitioning prototypes from bench testing to real-world deployment due to fragility, unreliability, bulkiness, and high replication costs, making them unsuitable for comprehensive evaluation.

Innovation Solution

A modular electronics prototyping system comprising modules with electrically insulative substrates and breadboards that allow for easy interconnection and secure fastening, using orientation features and symbols for proper electrical connections, facilitating the creation of robust and scalable prototypes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If prototypes are built using traditional breadboard methods, then quick exploration and iteration of ideas is enabled, but the prototypes become fragile, unreliable, and too bulky for real-world deployment

Engineering Contradiction:

Improvequick exploration and iterationVSAvoidfragility and unreliability

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The system divides the prototype into modular units with standardized interfaces. Each module is a self-contained functional unit that can be independently designed, tested, and replaced. This segmentation allows for reliable real-world deployment while maintaining quick iteration capabilities through modular reconfiguration.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The system employs universal mounting holes, standardized connector interfaces, and common substrate materials across all modules. This universality enables different modules to be combined in various configurations for different applications, ensuring reliability through standardized connections while facilitating rapid prototyping through reusability.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Ease of manufacture

If prototypes are built using traditional methods, then initial idea testing is possible, but replication becomes time-consuming and expensive

Engineering Contradiction:

Improveinitial idea testingVSAvoidreplication time

Core Design Contradiction:

Ease of manufactureVSLoss of time

Solution Approach 1:

The system pre-establishes standardized mounting hole patterns, connector interfaces, and substrate designs before actual prototyping begins. This preliminary standardization allows for rapid replication of prototypes by simply assembling pre-designed modules rather than building from scratch each time.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The modular design allows individual modules to be easily discarded or replaced without affecting the entire prototype. Successful modules can be recovered and reused in different configurations, while failed modules can be quickly replaced with standardized alternatives, significantly reducing replication time and cost.

Inventive Principle:

Principle #34Discarding and recovering

3Adaptability or versatility

If prototypes are built using conventional approaches, then basic functionality can be achieved, but they lack the robustness needed for comprehensive real-world testing

Engineering Contradiction:

Improvebasic functionalityVSAvoidrobustness for real-world deployment

Core Design Contradiction:

Adaptability or versatilityVSStrength

Solution Approach 1:

The system uses composite construction combining rigid substrates with flexible mounting mechanisms, metal connectors with insulating elements, and protective housings. This composite approach provides the robustness needed for real-world deployment while maintaining the adaptability to configure different functional combinations.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The modular design incorporates built-in tolerance features, standardized interfaces with built-in alignment mechanisms, and protective mounting structures that anticipate and compensate for real-world conditions. This beforehand cushioning ensures robust operation in varied environments while preserving functional versatility.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Data Source

PatentUS12177969B2Modular electronic prototyping platforms

Publication Date: 2024.12.24 MICROSOFT TECHNOLOGY LICENSING LLC

AI summary

The description relates to electronic prototyping platforms. One example can include an electrically insulative substrate having generally opposing first and second major surfaces and that includes an orientation feature that is visible on both of the first and second major surfaces. The example can include a first mounting hole through the substrate that is bordered by a first electrical conductor associated with data transmission. The example can also include a second mounting hole through the substrate that is bordered by a second electrical conductor associated with electrical ground, and a third mounting hole through the substrate that is bordered by a third electrical conductor associated with electrical power. The example can also include an edge connector tab defined by the substrate and having three exposed electrically conductive contacts that are coupled to the data electrical conductor, the ground electrical conductor, and the power electrical conductor and insulated from one another.