Modular Electronics Rack for Deep Sea Pressure Resistance
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Solution Overview
Problem
Deep sea oil and gas production equipment, particularly control and monitoring electronics, face challenges in withstanding extreme water pressures and temperatures, leading to reliability issues and increased maintenance needs due to environmental effects.
Innovation Solution
A ruggedized canister system with a cylindrical housing and modular electronic rack system, featuring a backplane with radiating rib members for structural support, reduced cabling through direct electrical connections, and a wedge lock system for enhanced thermal conduction, designed to withstand deep sea conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If control and monitoring electronics are located at subsurface locations on the ocean floor, then communication reliability is improved and active control is enabled, but the electronics must withstand extreme water pressures and temperatures which reduces equipment reliability
Solution Approach 1:
The electronic system is divided into modular rack-mounted components that can be independently tested and replaced. The backplane architecture segments the electronics into discrete functional units, allowing maintenance without complete system replacement and reducing downtime in harsh environments.
Solution Approach 2:
The extreme deep-sea environment is addressed by using the surrounding water as a heat sink. The electronics rack design incorporates thermal management that leverages the cold deep-sea water to dissipate heat from electronic components, converting the harmful cold environment into a beneficial cooling mechanism.
2Reliability
If a protective enclosure is provided to withstand extreme pressure and temperature, then electronics reliability is improved, but device complexity increases
Solution Approach 1:
The cylindrical pressure vessel serves multiple functions: it provides structural strength to withstand deep-sea pressure, acts as a thermal management system by serving as a heat sink, and provides mechanical mounting for the electronic rack. This multi-functionality reduces the need for separate specialized components.
Solution Approach 2:
The enclosure design transitions from complex multi-layer insulation and active cooling systems to a simpler approach using passive thermal conduction through the pressure vessel walls. The design parameters are changed to leverage the natural thermal properties of the deep-sea environment.
3Productivity
If modular electronic rack system with reduced cabling is used, then maintenance needs are reduced and downtime is minimized, but manufacturing complexity increases
Solution Approach 1:
The electronic system uses a backplane architecture with modular card slots that segment the electronics into replaceable units. This reduces cabling complexity by using standardized connectors and allows quick swapping of failed components without extensive re-wiring, improving operational availability.
Solution Approach 2:
Multiple electrical connections and signal paths are merged into integrated backplane connectors. The modular design combines power distribution, data communication, and control signals into unified interface standards, reducing the number of separate cables and connection points required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a reliable and maintenance-reduced electronics enclosure that minimizes downtime by withstanding extreme pressures and temperatures, ensuring operational reliability and efficient heat dissipation in deep sea environments.
Implementation Method 1
a wedge lock system for enhanced thermal conduction
Data Source
AI summary
A ruggedized canister system having a cylindrical housing and a modular electronic rack system disposed therein. The modular electronic rack system includes a backplane and a plurality of rib members radiating outwardly from the backplane. The rib members extend from the backplane at a proximal end in a direction generally orthogonal to the longitudinal axis of the backplane toward a distal end. An input/output device extends along at least a portion of the backplane and includes a power input and a signal output electrically coupled thereto. A plurality of electronic slots are positioned within a space define by the rib members when viewed in plan view. Each of the electronic slots is configured to physically and operably receive an electronic card. Each of the electronic slots is electrically connected to the input/output device for electrical communication between the electronic card and the input/output device.