Modular Enclosure Assembly with Interpenetrating Back Plates
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Solution Overview
Problem
Existing enclosures for terminal wiring and distribution are limited in size, lack flat surfaces for securing fixtures, and have overlapping arrangements that obstruct available wall space, making them unsuitable for large installations and inadequate for securing electronic devices.
Innovation Solution
A modular enclosure assembly with interpenetrating structures beneath the back base plate, allowing for the attachment of electronic devices and using polymers to avoid interference with wireless transmissions, while enabling the creation of small, medium, and large enclosures using molding equipment of limited size, with hinged panels for access and a design that maintains a clear working surface for device attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If metal enclosures are manufactured in various dimensions, then the availability of different sizes is improved, but the investment in manufacturing equipment increases
Solution Approach 1:
The enclosure is divided into multiple modular subassemblies (first subassembly, second subassembly, etc.) that can be manufactured separately using standard-sized molding equipment and then assembled together. This segmentation allows a single molding machine to produce components for enclosures of various final sizes without requiring multiple specialized machines.
Solution Approach 2:
Multiple subassemblies are nested or stacked vertically to form larger enclosure configurations. The subassemblies interlock through complementary features (protrusions fitting into recesses, flanges, screws) to create enclosed spaces of different dimensions while using the same basic manufacturing processes.
2Strength
If overlapping arrangements are used to interlock modular structures, then the structural integrity is improved, but the available wall surface area is reduced
Solution Approach 1:
The interlocking mechanism is moved from the front wall surface to the rear wall surface. Subassemblies interlock through protrusions and recesses located on the back sides, allowing the front surfaces to remain flush and fully available for mounting devices, while structural integrity is maintained through the rear interlocking arrangement.
3Object-affected harmful factors
If polymer material is used for the enclosure, then the interference with wireless transmissions is eliminated, but the mechanical strength may be reduced
Solution Approach 1:
The enclosure subassemblies are constructed from polymer materials that provide electrical insulation and do not interfere with wireless transmissions. The design compensates for any perceived strength deficiencies through thoughtful structural features such as ribbing, interlocking mechanisms, and appropriate thickness to achieve the required mechanical properties.
Data Source
AI summary
A modular enclosure assembly comprising: an upper and lower enclosure subassemblies, interconnected by a partial interpenetration, and a pair of hinged panel subassemblies for opening/closing the inner space of the enclosure subassemblies. Each of the enclosure subassemblies incorporates a back base plate having a first interpenetrating zone, located at an end of a lower left side of the back base plate, and a second interpenetrating zone, located at an end of a lower right side of the back base plate and juxtaposed with the first interpenetrating zone. The second interpenetrating zone incorporates a slat partially superposed on a rear surface of the back base plate where and with which this second interpenetrating zone forms a monoblock structure and from which the slat extends downwardly, beyond the rear surface of the back base plate.