Modular Enclosure Thermal Breaks for Temperature-Sensitive Components
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Solution Overview
Problem
Existing modular enclosures for temperature-sensitive components face inefficiencies in construction due to multi-stage assembly processes and inadequate thermal resistance, with prior solutions failing to prevent substantial heat conduction through metal components.
Innovation Solution
A modular enclosure design featuring interconnected modular wall sections with vertical strut channels and a core section, which allows for efficient assembly and significantly reduces thermal conduction by isolating temperature-sensitive components within a high thermal resistance environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If multi-stage assembly process is used for constructing modular enclosures, then construction can be organized in phases, but assembly time and construction efficiency are significantly increased
Solution Approach 1:
The patent combines wall assembly and component mounting into a single integrated stage. The modular wall sections are pre-configured with mounting structures that allow components to be attached during the wall assembly process itself, eliminating the need for separate modification stages and reducing overall construction time.
Solution Approach 2:
The mounting structures are pre-integrated into the modular wall sections during manufacturing. This preliminary configuration of mounting points and support elements allows workers to directly attach components during wall assembly without needing to perform additional modification work in later stages.
2Strength
If metal components are used to connect wall panels in modular enclosures, then structural strength and stability are improved, but thermal conduction increases significantly reducing thermal resistance
Solution Approach 1:
The patent introduces non-conductive fastening elements and thermal breaks as intermediary components between metal wall panels. These elements maintain the structural connection and stability provided by metal components while interrupting the thermal conduction path, preventing heat transfer through the enclosure walls.
Solution Approach 2:
The patent employs composite construction methods combining conductive metal components for structural integrity with non-conductive materials (such as thermal breaks or insulating fasteners) to create a hybrid connection system that provides both mechanical strength and thermal resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enables faster and more efficient assembly of modular enclosures while providing high thermal resistance, effectively mitigating heat transfer and maintaining the performance of temperature-sensitive components.
Implementation Method 1
a core section disposed between the inner alcove and the outer alcove; wherein the inner strut channel and the outer strut channel are thermally insulating materials
Implementation Method 2
Thermal conduction is a long-standing problem for prior enclosures that contain temperature-sensitive components. Accordingly, a long-felt need has existed for enclosures having adequate overall thermal resistance.
Data Source
AI summary
Disclosed herein are modular enclosures for temperature-sensitive components that include a modular wall section some of which include a vertical support panel, a vertical strut channel connected to the vertical support panel, and a temperature-sensitive component connected to the vertical strut channel.