Modular Faceplate Optical Connection Reducing Signal Loss
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Solution Overview
Problem
In computing systems, the length of electrically conductive traces on printed circuit boards leads to significant signal loss due to insertion loss, especially at higher frequencies, limiting the use of high-speed components and requiring frequent updates to accommodate evolving technology and component changes.
Innovation Solution
The optical conversion module features a modular design with adaptable faceplates and optical connectors that can be modified to reduce trace lengths, allowing for hot-swappable components and improved heat management, enabling efficient data transmission and flexibility in meeting changing system requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If optical connectors are moved deeper within the computing system to reduce electrically conductive trace lengths, then signal loss is reduced, but the complexity of the optical conversion module increases
Solution Approach 1:
The optical conversion module is divided into separate functional components: a faceplate assembly with optical connectors and a carrier bracket with electrical interface. This segmentation allows the optical connectors to be positioned deeper within the system while keeping the electrical interface accessible, thereby reducing trace lengths without excessive complexity increase.
Solution Approach 2:
The patent extends the optical conversion module longitudinally deeper into the computing system using an extended carrier bracket. This dimensional extension allows optical connectors to be positioned closer to the processing aspects, reducing the length of electrically conductive traces and minimizing signal loss.
2Manufacturing precision
If the optical conversion module is designed with fixed components, then manufacturing precision is maintained, but adaptability to changing system requirements decreases
Solution Approach 1:
The faceplate assembly is designed to be removable and replaceable on the carrier bracket, transforming the system from a static fixed configuration to a dynamic reconfigurable one. This allows different faceplates with various optical connector configurations to be swapped based on system requirements while maintaining precise alignment through the standardized carrier bracket interface.
Solution Approach 2:
The carrier bracket is designed as a universal platform that can accommodate multiple different faceplate configurations. The standardized interface and alignment features enable a single carrier bracket to support various optical connector arrangements, making the system adaptable to changing requirements without sacrificing manufacturing precision.
3Device complexity
If system components are made non-modular, then device complexity is reduced, but productivity during system updates decreases
Solution Approach 1:
The optical conversion module is segmented into independent replaceable components (faceplate assembly and carrier bracket), enabling selective replacement of only the optical connectors or faceplate without replacing the entire module. This increases system update efficiency by allowing targeted component replacement while maintaining manageable complexity through modular design.
Solution Approach 2:
The faceplate assembly is pre-configured with specific optical connector arrangements during manufacturing, allowing for hot-swappable replacement without requiring complex reconfiguration or shutdown procedures. This preliminary preparation enables rapid system updates and maintenance while keeping the overall module structure relatively simple.
Data Source
AI summary
An optical conversion module having a printed circuit board having a proximate and a distal end and including an electrical interface at the distal end. The optical conversion module also having a faceplate modularly connected to the proximate end of the printed circuit board, the faceplate having at least one retention device. The optical conversion module further having an optical transceiver disposed on and electrically connected to the printed circuit board, a chip optical connector disposed on and optically connected to the optical transceiver, and a faceplate optical connector modularly disposed through the faceplate and modularly connected to the chip optical connector through an optical fiber jumper.