Modular Faceplate Optical Sub-Assembly EMI Shielding

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Solution Overview

Problem

Existing fiberoptic cable connections in computing systems face challenges with electromagnetic interference (EMI) and radio-frequency interference (RFI) shielding, mechanical integrity, and efficient assembly processes, particularly in the connection of fiber jumpers to compute modules.

Innovation Solution

A modular faceplate optical sub-assembly with interlocking sub-shells and conductive gaskets provides EMI/RFI shielding, secure mechanical integration, and allows fiber jumper connections before assembly into the compute module faceplate, ensuring easy installation and reduced interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If traditional fiberoptic cable connections are used in compute modules, then connectivity is achieved, but electromagnetic interference and radio-frequency interference shielding is insufficient

Engineering Contradiction:
ImproveEMI/RFI shieldingVSAvoidsignal integrity
Core Design Contradiction:
Object-affected harmful factorsVSReliability

Solution Approach 1:

The faceplate assembly is divided into multiple sub-shells (first sub-shell, second sub-shell) that can be assembled separately. Each sub-shell can be independently configured with EMI/RFI shielding properties, allowing the shielding function to be segmented and optimized without compromising the overall structural integrity or signal integrity requirements.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The sub-shells are constructed using composite materials that integrate EMI/RFI shielding capabilities with mechanical structural functions. The conductive gasket material combines electrical conductivity for shielding with mechanical compliance for secure attachment, creating a multi-functional component that addresses both shielding and mechanical integrity requirements.

Inventive Principle:
Principle #40Composite materials

2Productivity

If fiber jumper connections are made after faceplate assembly, then connectivity is established, but assembly complexity and installation time increase

Engineering Contradiction:
Improveassembly efficiencyVSAvoidassembly process
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The faceplate assembly is designed with pre-configured connection interfaces and alignment features that enable fiber jumper connections to be made during the assembly process itself, rather than requiring separate post-assembly steps. The sub-shells include predetermined mounting positions and connection points that facilitate efficient integration of fiber jumpers.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The assembly process merges multiple functions into a single integrated operation: the faceplate assembly simultaneously provides structural support, EMI/RFI shielding, and fiber connection interfaces. This consolidation eliminates the need for separate assembly steps for shielding and connectivity, improving overall assembly efficiency.

Inventive Principle:
Principle #5Merging (Combining)

3Strength

If simple faceplate structures are used, then manufacturing is easier, but mechanical integrity and shielding effectiveness are reduced

Engineering Contradiction:
Improvemechanical integrityVSAvoidmanufacturing complexity
Core Design Contradiction:
StrengthVSEase of manufacture

Solution Approach 1:

The faceplate is segmented into multiple sub-shells that can be manufactured separately using standard manufacturing processes, then assembled together to form the complete structure. This segmentation allows each component to be optimized for its specific function while maintaining overall mechanical integrity, and enables parallel manufacturing to reduce production time.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The sub-shells utilize thin-walled but structurally sound shell designs that provide adequate mechanical strength while minimizing material usage. The conductive gasket employs flexible material properties to ensure secure attachment and maintain electrical contact without requiring complex fastening mechanisms, balancing mechanical integrity with manufacturing simplicity.

Inventive Principle:
Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively shields against EMI/RFI, enhances mechanical integrity, and simplifies the assembly process by allowing pre-connection of fiber jumpers, improving the reliability and efficiency of fiberoptic cable connections in computing systems.

Implementation Method 1

conductive gaskets provides EMI/RFI shielding

Methodology Applied
Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS11199669B1Modular faceplate optical sub-assembly
Publication Date: 2021.12.14 HEWLETT PACKARD ENTERPRISE DEV LP
  • US11199669B1 patent drawing
  • US11199669B1 patent drawing
  • US11199669B1 patent drawing

AI summary

A faceplate optical sub-assembly is provided for accommodating a plurality of optical receptacles mounted in a faceplate of a computing device. The faceplate optical sub-assembly accommodates one or more optical receptacle housings having optically-connected front and rear optical bays. A collar having a single aperture surrounds the one or more optical bays, and a shell structure comprised of a pair of interlocking sub-shells engages on the rear of the collar. A gasket is disposed between the collar and the shell structure. The collar, gasket, and shell structure provide electromagnetic interference (EMI) shielding for optical connections made between optical fibers inserted in the front and rear optical bays, and rigidly engage the plurality of optical receptacle housings. The single aperture of the collar and the multi-part shell structure allows for insertion of a fiber jumper assembly into the rear bays of the faceplate optical sub-assembly prior to insertion into a faceplate of a computing device.