Modular Flexible PCB Assembly for Lower-Cost Device Adaptation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing flexible printed circuit boards (FPCs) have high preparation difficulties and costs due to their large, integrated structure, making them inflexible for use in various electronic devices and leading to waste and increased costs.
Innovation Solution
A flexible printed circuit board composed of multiple smaller flexible units, each with connecting structures and wires, allowing for easier assembly, reduced waste, and adaptability to different devices by replacing only specific units, with electrical connections facilitated through welding and adhesive layers for stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an integrated flexible printed circuit board is used, then electrical connection reliability is improved, but preparation difficulty and cost increase
Solution Approach 1:
The flexible printed circuit board is divided into multiple flexible units (first flexible unit, second flexible unit, etc.), each with independent connecting portions and wires. These segmented units are then assembled together through connecting structures (first connecting structure, second connecting structure) to form the complete circuit board, reducing preparation difficulty while maintaining electrical connection reliability through standardized connection interfaces.
2Stability of the object's composition
If an integrated flexible printed circuit board is used, then structural integrity is improved, but preparation cost increases
Solution Approach 1:
The circuit board is segmented into multiple flexible units that can be manufactured separately and then assembled. Each unit maintains its own structural integrity through protective layers and substrate designs, while the overall structure achieves integrity through the connecting structures that electrically and mechanically link the units together.
Solution Approach 2:
Multiple flexible units are merged through connecting structures (including welding points and connecting portions) to form a unified circuit board assembly. The connecting structures integrate the separate units both electrically and mechanically, achieving overall structural integrity while allowing for more efficient preparation and reduced costs.
3Area of stationary object
If a large integrated flexible printed circuit board is used, then coverage area is improved, but material utilization decreases
Solution Approach 1:
The large coverage area is achieved by assembling multiple smaller flexible units together rather than manufacturing one large integrated board. This segmentation allows each unit to be optimized for its specific function and size, reducing material waste during preparation while the assembled configuration achieves the required total coverage area.
4Device complexity
If an integrated flexible printed circuit board is used, then electrical connection is simplified, but adaptability to different devices decreases
Solution Approach 1:
The circuit board is segmented into modular flexible units with standardized connecting structures. This segmentation enables different combinations and configurations of units to be assembled for different electronic devices, improving adaptability while the standardized interfaces maintain relatively simple electrical connection procedures.
Solution Approach 2:
The modular design allows the circuit board configuration to be dynamically adjusted by selecting and assembling different flexible units based on specific device requirements. This dynamic adaptability enables the same basic unit types to serve multiple device applications while maintaining straightforward connection processes through standardized interfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces preparation complexity and costs, enhances utilization of materials, and allows for greater flexibility in device applications by enabling the reuse and reconfiguration of FPC units, improving panelization rates and reducing electronic device thickness.
Implementation Method 1
the first connecting structure runs through the through hole and is electrically connected to the second connecting structure, so that the first wire of the first flexible unit is electrically connected to the second wire of the second flexible unit
Implementation Method 2
each of the first wires includes a welding point located at the first connecting portion; each of the welding points is provided with a first connecting structure, and the welding point is electrically connected to the first connecting structure
Data Source
AI summary
A flexible printed circuit board includes a first flexible unit and a second flexible unit, where the first flexible unit includes a first connecting portion and a plurality of first wires, and each of the first wires includes a welding point located at the first connecting portion; each of the welding points is provided with a first connecting structure, and the welding point is electrically connected to the first connecting structure; the second flexible unit includes a first face and a second face, where the first face is located on a side of the second flexible unit facing away from the first flexible unit; the second flexible unit further includes a second connecting portion and a plurality of second wires; the second connecting portion is provided with a plurality of through holes, and the plurality of through holes are provided in one-to-one correspondence to the plurality of second wires.


