Modular Heat Sink Assembly with Floating Members for Even Force Distribution

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Solution Overview

Problem

In densely packed circuit boards with varying component heights and thermal energies, traditional large heat sinks can cause thermal damage due to uneven force distribution and excessive heat transfer between components, especially when components are lid-less.

Innovation Solution

A modular heat sink assembly featuring a main heat sink with movable, thermally connected additional heat sink members that adjust to different component heights via spring attachments and heat pipes, allowing for controlled heat transfer and reduced risk of damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If a large heat sink is used to cool multiple components, then heat dissipation capacity is improved, but thermal damage risk increases due to excessive heat transfer between components

Engineering Contradiction:

Improveheat dissipation capacityVSAvoidthermal damage risk

Core Design Contradiction:

Loss of energyVSObject-affected harmful factors

Solution Approach 1:

The heat sink is divided into multiple independent heat sink members (first heat sink member, second heat sink member, third heat sink member) that can be separately positioned over different components. Each member independently dissipates heat from its respective component, preventing excessive heat transfer between components while maintaining overall heat dissipation capacity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The heat sink members are made movable relative to each other along the vertical direction, allowing dynamic adjustment of their positions. This enables each heat sink member to be independently positioned to match the specific height and thermal characteristics of each component, optimizing heat dissipation while minimizing thermal damage risk.

Inventive Principle:

Principle #15Dynamics

2Area of stationary object

If a large heat sink is used to cover multiple components, then heat dissipation coverage is improved, but force distribution becomes uneven causing component damage

Engineering Contradiction:

Improveheat dissipation coverageVSAvoidcomponent integrity

Core Design Contradiction:

Area of stationary objectVSStrength

Solution Approach 1:

The unified heat sink structure is segmented into multiple independent heat sink members. Each member independently contacts and applies force to its respective component, ensuring even force distribution. This prevents the uneven force concentration that would occur with a single large heat sink covering multiple components of varying heights.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The heat sink members are configured to move vertically, allowing each member to independently adjust its position to match the height of its target component. This dynamic adjustment ensures that each component receives appropriate contact force without excessive or uneven loading, protecting component integrity while maintaining full heat dissipation coverage.

Inventive Principle:

Principle #15Dynamics

3Loss of energy

If individual heat sinks are used for each component, then heat dissipation effectiveness is improved, but device space consumption increases

Engineering Contradiction:

Improveheat dissipation effectivenessVSAvoiddevice space consumption

Core Design Contradiction:

Loss of energyVSArea of stationary object

Solution Approach 1:

Multiple independent heat sink members are merged into a single integrated heat sink assembly that functions as one unit. The members share common mounting features and can be installed together, providing individualized heat dissipation for each component while occupying less overall space than separate heat sink installations would require.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The heat sink members are designed with universal characteristics - they can be positioned over different components with varying heights and thermal requirements. Each member serves multiple potential components, and the assembly as a whole can adapt to various component layouts, reducing the space needed compared to dedicated individual heat sinks for each component type.

Inventive Principle:

Principle #6Universality (Multi-functionality)

4Stability of the object's composition

If heat sink members are fixed in position, then structural stability is improved, but adaptability to varying component heights is reduced

Engineering Contradiction:

Improvestructural stabilityVSAvoidadaptability to component heights

Core Design Contradiction:

Stability of the object's compositionVSAdaptability or versatility

Solution Approach 1:

The heat sink members are designed to be movable relative to each other along the vertical direction, enabling dynamic adjustment to accommodate components of different heights. This mobility allows each member to independently position itself for optimal thermal contact while maintaining structural stability through controlled movement mechanisms and stable final positioning.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The segmented structure of multiple independent heat sink members allows each segment to move and adapt independently to its target component's height. This segmentation provides the flexibility needed for adaptability while each member maintains its own structural stability, and the overall assembly achieves stability through the coordinated positioning of its segments.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The modular heat sink assembly effectively dissipates heat from components of varying heights and thermal energies, preventing thermal damage by distributing force evenly and regulating heat transfer, making it suitable for use in small areas where individual heat sinks cannot fit.

Implementation Method 1

The additional heat sink member(s) is thermally connected to the main heat sink member so that heat spreading occurs over the additional heat sink member(s) and the main heat sink member. For example, one or more heat pipes may connect the main heat sink member and the additional heat sink member(s) so that thermal energy may be transferred from the additional heat sink member(s) to the main heat sink member.

Methodology Applied

Scientific EffectHeat pipe: Heat Pipe

Implementation Method 2

When the thermal energy is transferred from the component to the heat sink, the thermal energy is rapidly dissipated to the surrounding environment due to the large surface area of the fins, which cools the component.

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 3

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS8109321B2Modular heat sink assembly comprising a larger main heat sink member thermally connected to smaller additional floating heat sink members

Publication Date: 2012.02.07 WSOU INVESTMENTS LLC

AI summary

A modular heat sink assembly is disclosed. The heat sink assembly includes a main (larger) heat sink member having one or more voids through the member. The heat sink assembly also includes one or more additional (smaller) heat sink members that fit within the voids of the main heat sink member and are able to move (float) within the voids while thermally connected to main heat sink member. The thermal connection to the main heat sink member may be accomplished by incorporating heat pipes as a bridge between the heat sink members, so that heat spreading, and regulation thereof, occurs over the additional heat sink members and the main heat sink member.