Modular Form Board for Aircraft Wire Bundle Assembly
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Solution Overview
Problem
The existing methods for assembling wire bundles in aircraft require high costs due to the need for customized form boards for each configuration, which are time-consuming to design and store, and do not allow for quick reconfiguration or efficient use of space in manufacturing environments.
Innovation Solution
Automation technology is employed to robotically assemble form boards, using software to generate robot control files from engineering data, allowing for rapid design and assembly of form boards with interchangeable devices, enabling quick reconfiguration and eliminating the need for storage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If customized form boards are created for each wire bundle configuration, then manufacturing precision and wire bundle configuration accuracy are improved, but device complexity and storage requirements increase
Solution Approach 1:
The form board is divided into multiple modular devices that can be independently positioned and configured. Each device can be placed at specific locations on the form board to define different wire bundle configurations, allowing the system to handle multiple configurations with a single standardized form board rather than requiring separate customized boards for each configuration.
Solution Approach 2:
A single standardized form board design serves multiple functions by accommodating different wire bundle configurations through the strategic placement of modular devices. The form board itself becomes a universal platform that can be reused across different configurations, eliminating the need to create and store multiple customized form boards.
2Adaptability or versatility
If multiple customized form boards are maintained for different configurations, then adaptability to various wire bundle configurations is improved, but loss of time for design and setup increases
Solution Approach 1:
The form board configuration is made dynamic through the ability to quickly reposition and reconfigure modular devices on a standardized form board. This allows the system to adapt to different wire bundle configurations on-demand without the time-consuming process of designing and creating new form boards for each configuration.
Solution Approach 2:
The modular devices are pre-designed and standardized, allowing them to be quickly deployed and configured on the form board when needed. This preliminary preparation of standardized components eliminates the need for time-consuming design work during configuration changes.
3Productivity
If standardized form boards with modular devices are used, then productivity and reconfiguration speed are improved, but manufacturing precision requirements increase
Solution Approach 1:
The modular devices incorporate localized positioning features such as holes, slots, or mounting mechanisms that ensure precise placement at specific locations on the form board. This local precision mechanism allows the devices to be quickly positioned while maintaining the required manufacturing precision for wire bundle configuration accuracy.
Data Source
AI summary
Systems and methods for designing and assembling form boards with attached wire routing devices for use in wire bundle assembly. The assembly method comprises: (a) establishing a coordinate system of a form board having a multiplicity of holes; (b) using a computer system to determine locations of form board devices of different types with reference to the coordinate system of the form board based on engineering data specifying a wire bundle configuration; and (c) fastening the form board devices of different types to respective holes of the form board having centers closest to respective locations determined in step (b). The form board devices may be inserted robotically or manually.