Modular Frame With Leaf Springs for Variable Thickness Electronics
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Solution Overview
Problem
High-volume producers face significant costs in inventory handling and tracking due to the complexity of managing and reusing components across multiple products, leading to increased costs and potential errors from incompatible components.
Innovation Solution
A modular electronic assembly design featuring a frame with leaf springs to securely mount electronic devices of varying thicknesses, allowing for the separate handling and reuse of components like heat sinks and processors, enabling cost-effective and efficient materials handling and inventory management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If components are standardized across multiple products, then inventory costs and complexity are reduced, but adaptability to different product configurations is limited
Solution Approach 1:
The frame is divided into multiple slots that can independently accommodate different electronic devices. Each slot is a separate, standardized unit that can be configured differently based on product requirements, allowing standardization at the component level while maintaining flexibility at the system level.
Solution Approach 2:
The frame structure with standardized slots serves multiple functions: it provides mechanical support, enables thermal management through integrated heat sinks, allows for different device configurations, and facilitates modular assembly. This universal design reduces inventory complexity while adapting to various product needs.
2Adaptability or versatility
If a modular frame design with multiple slots is used, then adaptability to different electronic devices is improved, but structural complexity increases
Solution Approach 1:
The frame is segmented into multiple identical or similar slots with standardized dimensions and mounting mechanisms. This segmentation allows the complex adaptability function to be distributed across simple, repeating units, reducing the overall structural complexity while maintaining high adaptability.
3Temperature
If heat sinks are integrated as separate assemblies, then thermal management effectiveness is improved, but assembly complexity increases
Solution Approach 1:
The heat sink assemblies are merged with the frame structure, where heat sinks are positioned to directly contact electronic devices mounted in the frame slots. This integration combines the thermal management function with the structural support function, improving thermal effectiveness while actually reducing assembly complexity by eliminating separate mounting steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces inventory and supply chain costs by allowing for the reuse of expensive components across multiple products, improves system reliability through modular construction, and simplifies the handling and tracking of components, while minimizing errors and vibrations.
Implementation Method 1
at least one spring adapted to secure the electronic device to the frame
Data Source
AI summary
An assembly comprises a frame adapted to mount an electronic device having a thickness within a range of thicknesses. The frame is adapted to assemble to a heat sink assembly after the electronic device is mounted. The assembly further comprises at least one spring adapted to secure the electronic device to the frame.