Modular Gas Injector for Epitaxy Uniformity
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Solution Overview
Problem
Conventional semiconductor process chambers face challenges in achieving precise temperature control and uniform gas flow, which affects the throughput and production yields in fabricating next-generation devices.
Innovation Solution
The design includes a process chamber with a gas injector system featuring a base ring, inject ring, and gas injectors that allow for improved gas distribution and control, along with a gas mixture assembly that manages flow rates and pressures to ensure uniform deposition across the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional process chambers are used, then device fabrication can proceed, but temperature control precision and gas flow uniformity are insufficient for next-generation devices
Solution Approach 1:
The gas injector is divided into a modular design with a base body and a separate insert component. The insert can be independently replaced to optimize gas flow patterns for different process requirements, enabling precise temperature and flow control without redesigning the entire injector system.
Solution Approach 2:
The gas injector design allows dynamic adjustment of gas flow characteristics through the insert component, which can be configured to deliver uniform gas distribution across the substrate. This dynamic control enables precise temperature maintenance while supporting high-speed processing.
2Manufacturing precision
If conventional gas injectors are used, then gas delivery is provided, but gas flow uniformity across the substrate is insufficient
Solution Approach 1:
The injector is segmented into a base body and an insert, where the insert contains the gas distribution features. This segmentation allows the complex gas flow control functionality to be concentrated in a replaceable component, simplifying the overall system while achieving uniform gas distribution.
Solution Approach 2:
The insert acts as an intermediary component between the gas supply and the substrate. It mediates the gas flow to ensure uniform distribution across the substrate surface, decoupling the complexity of flow control from the main injector body.
3Adaptability or versatility
If hardware components are not easily replaceable, then system integrity is maintained, but cost of replacement and adaptability are increased
Solution Approach 1:
The injector design separates the insert from the base body, creating a modular system where the insert can be independently replaced. This maintains system integrity through standardized interfaces while enabling easy replacement and adaptation of the gas distribution component.
Data Source
AI summary
The present disclosure generally relates to gas inject apparatus for a process chamber for processing of semiconductor substrates. The gas inject apparatus include one or more gas injectors which are configured to be coupled to the process chamber. Each of the gas injectors are configured to receive a process gas and distribute the process gas across one or more gas outlets. The gas injectors include a plurality of pathways, a fin array, and a baffle array. The gas injectors are individually heated. A gas mixture assembly is also utilized to control the concentration of process gases flown into a process volume from each of the gas injectors. The gas mixture assembly enables the concentration as well as the flow rate of the process gases to be controlled.