Modular Grid Substrate Support for Semiconductor Processing
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Solution Overview
Problem
Existing substrate supports for sensitive or thin substrates with large surface areas in the semiconductor and photovoltaic industries are cumbersome to manufacture, material-intensive, and inflexible, making them costly and inefficient to use across various processes.
Innovation Solution
A modular substrate support system comprising intersecting longitudinal and transverse members forming a grid, with form-fitting connections and adaptable holding devices, allowing for customizable assembly and use of materials like CFC, CFRP, or graphite with coatings for thermal and electrical decoupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solid plates with cutouts are used for substrate support, then substrate holding stability is improved, but manufacturing complexity and material usage increase
Solution Approach 1:
The substrate support is divided into a modular grid structure consisting of multiple longitudinal and transverse members that can be assembled together. This segmentation allows for simplified manufacturing of individual components while maintaining overall structural stability for substrate holding.
2Strength
If solid plates are used for substrate support, then structural strength is improved, but material usage and waste increase
Solution Approach 1:
Instead of using a solid plate, the support structure is segmented into a grid of longitudinal and transverse members. This reduces material consumption while maintaining sufficient structural strength through the distributed framework design.
Solution Approach 2:
The grid structure creates a porous or open framework that provides structural support with minimal material usage. The spaces between grid members reduce overall material consumption and waste while maintaining necessary mechanical properties.
3Ease of manufacture
If solid substrate supports are used, then manufacturing simplicity is improved, but adaptability decreases
Solution Approach 1:
The modular grid structure consists of standardized longitudinal and transverse members that can be easily assembled and disassembled. This segmentation enables simple manufacturing of individual components while allowing flexible configuration to adapt to different substrate sizes and process requirements.
Solution Approach 2:
The substrate support design allows for dynamic reconfiguration by assembling or disassembling grid members and adjusting holding devices. This enables the same basic structure to adapt to various process conditions and substrate types, enhancing versatility without complicating manufacturing.
4Reliability
If multiple substrate supports are stocked for different processes, then process-specific performance is improved, but inventory complexity and cost increase
Solution Approach 1:
The modular grid structure with adjustable holding devices serves as a universal substrate support that can be configured for multiple different processes and substrate types. This multi-functionality eliminates the need to stock multiple specialized supports, reducing inventory complexity while maintaining process-specific performance through appropriate configuration.
Data Source
AI summary
A substrate support for receiving substrates or wafers to be processed and for transporting said substrates or wafers in or through processing installations has universal application, is easily adaptable for specific tasks and is economical in use of material. Within a frame made of longitudinal and transverse supports, a plurality of longitudinal and transverse members are arranged intersecting in a grid-like manner, such that a base grid for directly or indirectly receiving substrates is formed. Both the longitudinal and transverse supports and the longitudinal and transverse members are positively connected to one another.