Modular Head-Mounted Device Frame for Upgradeable Electronics
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic spectacle frames lack modularity, requiring redesign when modifications such as adding sensors or changing battery types are needed, limiting customization and upgrade possibilities.
Innovation Solution
A modular frame design for head-mounted devices with electronically connected temples and front parts, allowing easy integration and upgrade of electronic modules without altering the frame's overall design, featuring battery-powered temples and data transfer capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a specific spectacle frame design is created for each combination of electronic elements, then the frame can be optimized for that specific combination, but the complexity of designing and manufacturing multiple frame variants increases
Solution Approach 1:
The frame is divided into separate modular components: a front part and one or more temples that can be independently designed and manufactured. Each temple includes a cavity and connection means, allowing electronic modules to be attached after frame assembly. This segmentation enables the frame structure itself to remain simple while accommodating various electronic configurations through module selection rather than frame redesign.
2Ease of manufacture
If the spectacle frame is designed with fixed electronic elements, then manufacturing is simplified, but the ability to upgrade or modify the frame is limited
Solution Approach 1:
The frame design transitions from a static, fixed configuration to a dynamic, reconfigurable system. Electronic modules can be added, removed, or replaced by attaching or detaching from the temple cavities using the connection means. This dynamic approach allows the frame to adapt to different electronic configurations while maintaining a consistent base frame structure, simplifying manufacturing of the frame itself while enabling easy modifications.
3Reliability
If electronic modules are integrated directly into the frame structure, then connection reliability is improved, but the flexibility to change electronic components is reduced
Solution Approach 1:
The connection means and cavity design are created with universal applicability, allowing the same frame structure to accommodate different types of electronic modules through standardized interfaces. The connection means provides reliable electrical and mechanical coupling while maintaining the ability to connect various module types, achieving both reliability through consistent connection mechanisms and adaptability through modular compatibility.
Data Source
AI summary
A frame for a head mounted device including: a front part; a first temple configured to be electronically connected to the front part via a first connection and including a battery providing electrical power arranged in a cavity in the first temple and connected electrically to the first connection; a second temple configured to be electrically connected to the front part and having a cavity therein configured to receive therein at least one electronic module; and a second connection configured to connect electrically the battery of the first temple to the at least one electronic module of the second temple via the front part to receive power therefrom.