Modular Electronic Header Assembly for High Density Packaging
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Solution Overview
Problem
Existing electronic packaging technologies face challenges in efficiently handling manufacturing mistakes and deficiencies, leading to high scrap rates and inability to change electrical configurations, while also occupying valuable space and footprint in telecommunications signal conditioning circuits.
Innovation Solution
A modular electronic component package with separable modular header assemblies that allow for interconnection, enabling efficient handling of manufacturing defects, reducing scrap, and optimizing space usage through vertical and horizontal stacking, allowing for customizable configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional non-modular electronic packaging is used, then manufacturing simplicity is maintained, but scrap rates increase and rework capability is lost
Solution Approach 1:
The electronic packaging is divided into separate modular header assemblies that can be independently manufactured, tested, and assembled. Each header assembly contains specific electronic components and can be produced as discrete units, allowing defective modules to be replaced without scrapping entire assemblies, thereby reducing scrap rates while maintaining manufacturing simplicity through standardized modular units
2Device complexity
If traditional fixed-configuration packaging is used, then device complexity is reduced, but adaptability and reconfiguration capability are lost
Solution Approach 1:
The header assemblies incorporate movable and reconfigurable elements including adjustable terminations, repositionable components, and flexible mounting options that allow the electrical configuration to be dynamically changed after manufacturing. This enables adaptation to different applications without requiring complex fixed structures, as the modular design inherently supports reconfiguration through simple assembly changes
3Area of stationary object
If conventional packaging density is used, then space requirements are simplified, but component density and space efficiency deteriorate
Solution Approach 1:
The modular header assemblies enable vertical stacking and three-dimensional arrangement of electronic components, transitioning from traditional two-dimensional planar layouts to multi-layer spatial configurations. This dimensional change allows significantly higher component density within the same footprint area, as components are arranged in stacked layers rather than spread out horizontally, effectively doubling or tripling the usable component capacity per unit area
Data Source
AI summary
A device for electrically interconnecting and packaging electronic components. In one embodiment, a modular non-conducting base member having one or more component recesses and a plurality of lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the wire leads of the component routed through the lead channels to a conductive lead terminal. A plurality of lead terminals, adapted to cooperate with the non-conducting base member, are received therein, and adapted to place the device in signal communication with an external printed circuit board. The modular non-conducting base members are assembled or stacked to form a unitary modular assembly. Methods for fabricating the device are also disclosed.