Modular Heat Pipe Cooling for Power Conditioning Systems
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Solution Overview
Problem
Existing power conditioning systems face challenges in securing space and maintaining stable operation over long periods due to the large size of air-cooled cooling apparatuses, which struggle to efficiently manage heat generated by components like IGBT modules.
Innovation Solution
A modularized and downsized evaporator and condenser system using a vacuum-sealed heat pipe with a refrigerant that absorbs heat from the power device and transfers it to a condenser with multiple heat pipes and heat dissipation plates, enhancing heat emission performance and preventing foreign substance ingress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If air-cooled cooling devices are used to cool power devices, then stable operation is achieved, but the device size becomes much larger
Solution Approach 1:
The patent uses phase transition of refrigerant (liquid to gas in evaporator, gas to liquid in condenser) to transfer heat efficiently. The refrigerant absorbs heat from power devices through evaporation and releases heat to ambient air through condensation, achieving effective cooling in a compact volume compared to air-cooled systems.
Solution Approach 2:
The patent integrates the evaporator and condenser into a compact modular structure where components are nested or closely arranged. The evaporator is positioned to directly contact or closely approach power devices, while the condenser is integrated nearby, creating a space-efficient cooling system that maintains reliability without requiring large device volume.
2Reliability
If conventional cooling systems are used, then cooling function is provided, but space utilization is poor and installation is difficult
Solution Approach 1:
The cooling system is segmented into distinct functional modules: evaporator module with heat pipes directly contacting power devices, and condenser module with heat dissipation plates. This segmentation allows each module to be optimized independently and assembled in a compact configuration, improving space utilization while maintaining effective cooling function.
Solution Approach 2:
The patent utilizes vertical stacking and three-dimensional arrangement of cooling components. The evaporator is positioned at lower levels close to power devices, while the condenser is arranged above or adjacent to it, effectively using vertical space and improving overall space utilization compared to conventional horizontal layouts.
3Volume of stationary object
If modularized evaporator and condenser are used, then space is reduced and installation is easier, but heat emission performance must be maintained
Solution Approach 1:
The refrigerant undergoes phase transition from liquid to gas in the evaporator, absorbing large amounts of heat from power devices. The gaseous refrigerant then moves to the condenser where it condenses back to liquid, releasing heat to ambient air. This phase transition mechanism enables high heat emission performance in a compact modular structure.
Solution Approach 2:
The condenser is designed with multiple heat dissipation plates featuring convex and concave surfaces that increase the local surface area for heat exchange. This local quality enhancement at critical heat emission points maintains high heat emission performance despite the overall compact size of the modular condenser.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for efficient cooling, easy installation, and stable operation of power conditioning systems over extended periods while preventing foreign substance contact and optimizing space utilization.
Implementation Method 1
a liquid refrigerant which is injected into, and sealed in, the heat pipe at a vacuum state located in the evaporator, absorbs heat generated from the power device and evaporates into air even at a low temperature
Implementation Method 2
absorbs heat generated from the power device and evaporates into air
Implementation Method 3
The gaseous refrigerant moving to the condenser may emit heat to the air through a heat dissipation plate located in the condenser and change liquid to gas
Implementation Method 4
change liquid to gas and the liquid refrigerant of the condenser is circulated
Implementation Method 5
The refrigerant whose phase has changed into gas in the heat pipe located in the evaporator moves to the condenser through the hollow heat pipe
Data Source
AI summary
The present invention relates to an apparatus for cooling a power device of a power conditioning system. To this end, the present invention comprises: a power device; an evaporator butted to the power device; and a modularized condenser which is connected with the evaporator, placed on the power device, and equipped on the upper side of the power conditioning system. Accordingly, the present invention may easily secure a space, make it easy to install, and increase heat emission performance of the condenser so as to keep the power device at a low temperature, thereby enabling the system to be stably operated over a long period of time.