Modular Liquid-Cooled Heat Sink Mounting for Dense PCB Layouts
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Solution Overview
Problem
Existing cooling devices face challenges in effectively cooling high-powered electronic components like CPUs and GPUs due to difficulties in achieving reliable thermal contact and robust mounting on densely packed circuit boards with varying designs and layouts, and in minimizing mechanical impact on delicate components.
Innovation Solution
A modular liquid-cooled thermal heat sink device with a housing assembly, removable arms, and a thermal cooling plate that facilitates fluid circulation and secure mounting, allowing for adaptable fitting on different circuit board designs and minimizing disturbance to components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a designated cooler is mounted for targeted cooling of a specific component, then cooling effectiveness is improved, but it becomes challenging to mount on densely packed computer boards due to space constraints and varying board layouts
Solution Approach 1:
The cooling device is divided into modular components including a body with cooling channels, removable arms with engaging features, and mounting brackets. This segmentation allows the arms to be selectively positioned and removed to accommodate different component locations and board layouts, while the body remains fixed for consistent thermal contact with the target component.
Solution Approach 2:
The mounting brackets are designed with universal engagement features that can interface with various board hole patterns and component configurations. The brackets serve multiple functions: providing structural support, enabling removable arm attachment, and facilitating adaptation to different motherboard designs, thereby making a single cooler design compatible across multiple platforms.
2Strength
If the cooling device is made robust for secure mounting, then mounting stability is improved, but it may cause damage to delicate electronic components due to high mechanical impacts
Solution Approach 1:
The mounting brackets incorporate compliant elements and distributed force application features that cushion the mechanical impact during installation. The brackets are designed to flex slightly and distribute mounting forces across multiple contact points, preventing concentrated stress on delicate components while still achieving secure attachment.
Solution Approach 2:
The removable arms act as intermediaries between the robust body and the delicate electronic components. The arms provide the necessary mechanical strength for secure mounting while their removable nature and flexible connection allow them to absorb and distribute forces, protecting the underlying components from direct mechanical impact.
3Reliability
If the cooling device uses fixed mounting for reliable thermal contact, then thermal coupling is improved, but it reduces adaptability to different component shapes and sizes
Solution Approach 1:
The mounting system transitions from a completely fixed design to a semi-dynamic configuration where the arms can be positioned and removed. This allows the cooling device to adapt its configuration based on the specific component being cooled, while the body remains fixed to maintain reliable thermal contact. The dynamic arm positioning enables accommodation of various component shapes and sizes.
Solution Approach 2:
The engaging features on the arms and body are designed to self-align and self-lock into place during assembly. This self-service mechanism ensures reliable thermal contact and secure mounting without requiring complex adjustment procedures, while still allowing easy removal and reconfiguration for different components.
4Adaptability or versatility
If removable arms are used for adaptable mounting, then versatility is improved, but the engagement between arms and body may be insufficient under high mounting forces
Solution Approach 1:
The engaging features utilize asymmetric geometry where the arm insertion direction is optimized for ease of assembly, while the engagement geometry is designed to convert applied mounting forces into strong mechanical interlocking. The asymmetric design allows simple snap-in installation while providing robust resistance to withdrawal and lateral forces during operation.
Solution Approach 2:
The engaging features incorporate counteracting force distribution mechanisms that balance the high mounting forces applied to the body. The arm engagement points are positioned and dimensioned to create force triangles that distribute loads, preventing excessive stress concentration at the arm-body interface while maintaining strong attachment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modular design provides controlled coupling for improved cooling performance, adapting to various component sizes and board layouts while ensuring secure and minimal-impact mounting, enhancing targeted cooling effectiveness for high-powered components.
Implementation Method 1
facilitate fluid circulation within the body to effect an operative cooling of the thermal substrate through the thermal cooling plate
Implementation Method 2
thermal cooling plate configured to be in thermal contact with the thermal substrate
Data Source
AI summary
A modular liquid-cooled thermal heat sink device configured to thermally engage with a thermal substrate. The device comprises a housing assembly having a body defining a volume, the housing assembly comprising a thermal cooling plate configured to be in thermal contact with the thermal substrate, a fluid inlet and a fluid outlet, the housing assembly being configured to facilitate fluid circulation within the body to effect an operative cooling of the thermal substrate through the thermal cooling plate, the body comprising a plurality of first engaging features spaced about a perimeter of the body. The device further comprises a plurality of removable arms each comprising a first and second end, each of the plurality of arms being configured to mate with the body at a respective one of the plurality of first engaging features, wherein each of the first ends defines a second engaging feature dimensioned to cooperate and form an engagement with a respective first engaging feature, and wherein each of the second ends is configured to effect an operative fixing of the device to a supporting surface through application of a force on each of the second ends, the force being perpendicular to the supporting surface.