Modular Heat Sink Platform for Multi-Board Thermal Adaptation
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Solution Overview
Problem
The existing heat dissipation methods require a new heat sink for each type of circuit board, leading to a long research and development cycle, high costs, and inefficiencies due to the need for custom designs that match specific positions and heights of heat sources on different boards.
Innovation Solution
A multi-purpose heat sink platform with a universal design featuring a bracket and heat dissipation components, including convex plates of varying sizes and thicknesses, which can be combined with a primary panel to accommodate different heat sources, allowing for flexible adaptation to various circuit board assemblies without the need for extensive redesign.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a custom heat sink is designed for each type of board card to match specific heat source positions and heights, then the heat dissipation effectiveness is improved, but the research and development cycle is extended and costs increase
Solution Approach 1:
The patent applies universality by designing a standardized heat sink body that can serve multiple board card types. The heat sink body includes a standardized installation interface that can accommodate different board card configurations, allowing one heat sink design to fulfill multiple heat dissipation functions across different products, thereby reducing R&D cycles and costs while maintaining effective heat dissipation.
Solution Approach 2:
The patent segments the heat sink system into a reusable standardized heat sink body and interchangeable additional parts. This segmentation allows the core heat dissipation structure to be standardized and reused, while only the variable portions need to be modified for different board card types, significantly reducing the overall R&D and manufacturing cycle.
2Reliability
If a custom heat sink is designed for each type of board card to match specific heat source positions and heights, then the heat dissipation effectiveness is improved, but the manufacturing cost increases
Solution Approach 1:
The patent applies universality by designing a standardized heat sink body that can serve multiple board card types. The heat sink body includes a standardized installation interface that can accommodate different board card configurations, allowing one heat sink design to fulfill multiple heat dissipation functions across different products, thereby reducing R&D cycles and costs while maintaining effective heat dissipation.
Solution Approach 2:
The patent merges the common heat dissipation requirements of multiple board card types into a single standardized heat sink body design. By combining the shared heat dissipation functionality into one universal structure, the patent eliminates redundant manufacturing efforts and reduces overall production costs while still addressing the specific heat dissipation needs of different board cards through interchangeable additional parts.
3Loss of time
If a standardized heat sink platform is used for multiple board card types with interchangeable additional parts, then the research and development cycle is shortened and costs are reduced, but the adaptability to different heat source configurations must be maintained
Solution Approach 1:
The patent segments the heat sink system into a reusable standardized heat sink body and interchangeable additional parts. This segmentation allows the core heat dissipation structure to be standardized and reused, while only the variable portions need to be modified for different board card types, significantly reducing the overall R&D and manufacturing cycle.
Solution Approach 2:
The patent applies dynamics by designing an adjustable and configurable additional parts system that can be dynamically adapted to different heat source configurations. The additional parts include adjustable positioning mechanisms and configurable heat dissipation structures that can be modified based on the specific thermal requirements of different board cards, maintaining versatility while using a standardized platform.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly shortens the development and manufacturing cycles, reduces costs through high-volume production of platform parts, and enables efficient heat dissipation across multiple board types by using a common platform with interchangeable additional parts.
Implementation Method 1
the plurality of convex plates are combined with a front side of the primary panel (311) and are used for heat conduction in contact with heat dissipation sources of a corresponding circuit board assembly (100)
Implementation Method 2
the plurality of heat pipes (350) are set between the first heat fin (340) and the primary panel (311), and the plurality of heat pipes (350) are in contact with the first heat fin (340)
Data Source
AI summary
The present disclosure provides a multi-purpose heat sink, a method of manufacturing the same, a board card, and a multi-purpose heat sink platform, where the multi-purpose heat sink is composed of a bracket (310) and heat dissipation components. The cost of the multi-purpose heat sink in the present disclosure is low.