Modular Heat Sink Upgrade via Segmented Heat Pipe

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Solution Overview

Problem

Existing heat dissipation solutions for graphic cards, relying solely on heat sinks, are inconvenient to install and costly to upgrade, as they require users to dismount and replace the original heat dissipation module for improved efficiency.

Innovation Solution

A heat dissipating apparatus comprising a first heat sink, a second heat sink, and a fixing unit, where the second heat sink is connected to the first via a heat pipe structure with a wicking liquid and a flexible fixing unit, allowing for improved heat dissipation without requiring disassembly of the original heat sink.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If users upgrade heat dissipation efficiency by buying an extra graphic card heat dissipater, then heat dissipation efficiency is improved, but installation difficulty increases and assembly time is consumed

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidinstallation difficulty

Core Design Contradiction:

TemperatureVSEase of operation

Solution Approach 1:

The heat dissipation system is divided into a first heat sink (original) and a second heat sink (additional), connected through a heat pipe. This segmentation allows the additional heat sink to be installed without removing the original one, simplifying the upgrade process while improving heat dissipation efficiency.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The heat pipe structure enables the second heat sink to be nested with or attached to the first heat sink, creating a combined heat dissipation system. The heat pipe acts as the connecting bridge, allowing the additional heat sink to integrate with the existing structure without requiring disassembly.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Temperature

If users upgrade heat dissipation efficiency by buying an extra graphic card heat dissipater, then heat dissipation efficiency is improved, but assembly time increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidassembly time

Core Design Contradiction:

TemperatureVSLoss of time

Solution Approach 1:

By segmenting the heat dissipation system into separate heat sinks connected via heat pipe, the upgrade process becomes a simple attachment operation rather than a complete replacement, significantly reducing assembly time.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The heat pipe is pre-configured with connecting structures (connecting portion and connecting unit) that facilitate quick attachment. The fixing unit is designed to enable rapid securing of the second heat sink to the first, minimizing the time required for installation.

Inventive Principle:

Principle #10Preliminary action

3Temperature

If users upgrade heat dissipation efficiency by buying an extra graphic card heat dissipater, then heat dissipation efficiency is improved, but manufacture cost increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidmanufacture cost

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The segmented design allows manufacturers to produce the first and second heat sinks separately using standardized processes. The heat pipe connection interface is designed for modular assembly, reducing manufacturing complexity and cost compared to custom integrated solutions.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The heat pipe connecting structure is designed with universal compatibility, where the connecting portion and connecting unit can be integrated into standard heat sink manufacturing processes. This multi-functional design allows the same connection mechanism to work across different heat sink configurations, reducing development and tooling costs.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution simplifies installation, reduces assembly time, decreases manufacturing costs, and enhances heat dissipation efficiency while minimizing product damage.

Implementation Method 1

heat the liquid inside to be vaporized

Methodology Applied

Scientific EffectVaporization: Evaporation

Implementation Method 2

the vapor releases the heat through the pipe wall at the other end of the pipe, liquefies again

Methodology Applied

Scientific EffectCondensation: Condensation

Implementation Method 3

the liquid in the pipe vaporizes, and the vapor releases heat via convection. After the heat is dissipated, the vapor liquefies

Methodology Applied

Scientific EffectPhase change: Phase Change

Implementation Method 4

the liquid backflows downwards to the end of the pipe, which is the end close to the heating source, due to the capillary principle

Methodology Applied

Scientific EffectCapillary action: Capillary Action

Implementation Method 5

the vapor releases heat via convection

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS8737061B2Heat dissipating apparatus

Publication Date: 2014.05.27 ASUS GLOBAL PTE LTD

AI summary

A heat dissipating apparatus comprises a first heat sink, a second heat sink and a fixing unit. The first heat sink comprises a connecting portion. The second heat sink comprises a connecting unit which is inserted into the connecting portion. The fixing unit includes an end portion exposed outside the connecting portion and a body accommodated in the connecting portion.