Modular Heat Trace System for Semiconductor Conduits

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Solution Overview

Problem

Existing heat trace cables for conduits in semiconductor processing systems are time-consuming to install and replace, and they provide non-uniform heating due to their stiffness and limited adaptability to conduit shapes, leading to inefficient heat transfer and increased inventory and maintenance costs.

Innovation Solution

A modular heat trace assembly with hinged carrier members and flexible heat trace sections that can be easily secured to conduits, featuring preformed sizes and lengths, and a thermal insulation jacket with adaptive pockets to enhance heat transfer and reduce heat loss, along with a connector assembly for efficient connection and insulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If heat trace cables are fastened to conduits using bands or retaining straps, then the heat trace cables are secured to the conduits, but the installation process becomes time-consuming and burdensome

Engineering Contradiction:
Improvesecuring heat trace cablesVSAvoidinstallation time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The heat trace assembly is segmented into modular sections that can be independently installed and secured. Each module contains a heat trace cable pre-positioned within an insulating jacket, allowing for rapid installation without time-consuming fastening operations. The modular design enables quick attachment to conduits while maintaining secure positioning.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The heat trace cable and insulating jacket are pre-assembled into integrated modules before installation. This preliminary assembly includes pre-positioning the heat trace cable within the insulating jacket and pre-attaching securing mechanisms, eliminating the need for time-consuming field assembly and fastening operations during installation.

Inventive Principle:
Principle #10Preliminary action

2Temperature

If heat trace cables are wrapped around conduits, then they provide heating coverage, but they provide non-uniform heating due to stiffness and limited adaptability to conduit shapes

Engineering Contradiction:
Improveheating uniformityVSAvoidadaptability to conduit shapes
Core Design Contradiction:
TemperatureVSAdaptability or versatility

Solution Approach 1:

The insulating jacket is constructed from flexible materials that can conform to various conduit shapes and sizes. This flexibility allows the heat trace assembly to adapt to different conduit geometries while maintaining uniform contact and consistent heating performance. The flexible jacket ensures even heat distribution regardless of the conduit's shape.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The design allows for adjustment of physical parameters such as the flexibility and thickness of the insulating jacket to optimize performance for different conduit types. By varying these parameters, the heat trace assembly can be adapted to different application requirements while maintaining uniform heating characteristics.

Inventive Principle:
Principle #35Parameter changes

3Loss of energy

If conduits are surrounded by thermal insulation jackets, then heat loss to the surrounding environment is reduced, but the overall system complexity and manufacturing costs increase

Engineering Contradiction:
Improveheat lossVSAvoidsystem complexity
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The thermal insulation jacket is merged with the heat trace cable into a single integrated assembly. The insulating jacket is pre-formed with channels or recesses that accommodate the heat trace cable, combining two previously separate components (heating element and insulation) into one unified product. This reduces system complexity while maintaining effective heat retention.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The insulating jacket serves multiple functions simultaneously: it provides thermal insulation to reduce heat loss, structurally supports and positions the heat trace cable, and offers mechanical protection. This multi-functionality eliminates the need for separate components, simplifying the overall system while effectively reducing energy loss.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The modular system facilitates rapid installation and replacement, provides a uniform heating profile, reduces heat loss, and lowers inventory and maintenance costs by allowing for easy adaptation to conduit shapes and sizes, while maintaining efficient heat transfer.

Implementation Method 1

an electric heater in the form of a cable or a tape, known in the art as a 'heat trace,' is commonly used around the conduits to provide heat to the conduits

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Implementation Method 2

the conduits and the heat traces are sometimes surrounded by a thermal insulation jacket to reduce heat loss to the surrounding environment

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS8809751B2Modular heater system
Publication Date: 2014.08.19 WATLOW ELECTRIC MANUFACTURING CO
  • US8809751B2 patent drawing
  • US8809751B2 patent drawing
  • US8809751B2 patent drawing

AI summary

A heater system is provided that includes a hybrid insulation cover that has a first cover disposed around hinged carrier members and heat trace sections, and a second cover operatively engaged with the first cover and adapted for detachable placement around a heating target and its varying geometries. A flexible insulation jacket having a similar construction as the second cover is also provided for use with connector assemblies. Furthermore, a heater system is provided that includes at least one heat trace section encapsulated within adjacent insulating members for use with heating gaslines and pumplines of semiconductor processing systems.