Modular Heat Transfer Assembly for Uniform Seal Compression
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Solution Overview
Problem
Existing liquid cooling solutions for heat-emitting devices face issues with leakages, non-uniform coolant flow distribution, and water hammer effects, which can damage the devices and affect reliability.
Innovation Solution
A heat transfer assembly with a modular design that allows for uniform compression of a seal component between the heat emitting device and the cooling module, ensuring leak-proof sealing, and a symmetrical coolant flow path to prevent pressure imbalances, using flexible modules and a modular structure that can accommodate convex or concave curvatures for load balance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If direct cooling design is used to remove TIM and cold-plate body layers, then heat transfer efficiency is improved, but leak risk increases causing device damage
Solution Approach 1:
The cooling system is divided into modular cooling modules, each with its own sealed coolant flow path. This segmentation isolates potential leak sources to individual modules rather than the entire system, reducing the overall leak risk while maintaining direct cooling efficiency.
Solution Approach 2:
A flexible membrane is introduced as an intermediary between the coolant flow path and the electronic device baseplate. This membrane allows thermal energy to transfer from the baseplate to the coolant while providing a sealed barrier that prevents coolant leakage, thus maintaining both heat transfer efficiency and reliability.
2Device complexity
If single pump is used to drive coolant through multiple flow paths, then system complexity is reduced, but flow distribution becomes imbalanced
Solution Approach 1:
The coolant flow system is segmented into multiple independent cooling modules, each with dedicated inlet and outlet ports. This allows each module to be individually optimized for uniform flow distribution while maintaining overall system simplicity through modular architecture.
Solution Approach 2:
Each cooling module is designed with locally optimized flow path geometry and dimensions tailored to its specific thermal load requirements. This local customization ensures uniform coolant flow distribution in each module without requiring complex global flow control mechanisms.
3Temperature
If high velocity flow is used to cool certain paths, then cooling efficiency in those paths is improved, but water hammer effect occurs creating higher flowrate through final path
Solution Approach 1:
The cooling system is divided into parallel cooling modules with independent flow paths. This segmentation prevents high velocity flow in one path from creating water hammer effects that would propagate through and affect other paths, as each module's flow dynamics are isolated.
Solution Approach 2:
The modular design with individual flow control for each cooling module allows preliminary regulation of flow velocity to prevent conditions that would lead to water hammer effects. Flow rates can be optimized for each module's thermal needs without creating harmful pressure surges.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides reliable and efficient cooling by preventing leaks and ensuring balanced coolant flow, reducing thermal resistance, and eliminating the need for high thermal conductivity materials, thus enhancing the power rating and efficiency of heat-emitting devices like power converters while reducing electromagnetic interference.
Implementation Method 1
the second part allows a uniform compression of a seal component disposed on the first part between the heat emitting device and the at least one module
Implementation Method 2
a coolant to flow into the inlet, through the U-shaped coolant cavity and out of the outlet absorbing heat from the heat emitting devices
Implementation Method 3
Heat generated by the electronic device is conducted through three layers that include, an electronic device baseplate, a Thermal Interface Material (TIM), and the cold-plate body
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 2C~2D
AI summary
A heat transfer assembly (100) useful for dissipating heat from a heat emitting device (310) is disclosed. The assembly includes a module inlet (170,540,550,560) for receiving a coolant, at least one module (110) having a first part (120) with a recess (130) to receive a portion of the heat emitting device (310,390), and a second part (140) having a shaped cutout portion (150) and a solid portion (160), where the second part (140) allows a uniform compression of a seal component (132) disposed on the first part (120). The first part (120) and the second part (140) are mechanically connected to each other; and a module outlet (180) is used for discharging a heat absorbed coolant after absorbing heat from the heat emitting device (310,390), where the at least one module (110) is connected to the module inlet (170,540,550,560) and the module outlet (180).