Modular Heat Transfer System for Memory Module Thermal Management
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Solution Overview
Problem
The increasing trend towards compact computer designs with expanded memory capacity and higher clock rates leads to elevated waste heat, limiting maximum memory capacity due to thermal constraints, necessitating effective cooling solutions for electronic systems.
Innovation Solution
A heat transfer system comprising module heat conductors thermally connected to memory modules via removable coupling elements, which are then linked to a central heat conductor and a cooling device, utilizing materials with good thermal conductivity like graphite or copper, and incorporating heat spreaders and thermal interface materials to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If memory capacity and clock rates are increased, then computational performance is improved, but waste heat increases and thermal constraints are exceeded
Solution Approach 1:
The heat transfer system is divided into modular components: multiple memory modules each with its own heat conductor, a central heat conductor, and a cooling device. This segmentation allows heat to be collected and managed from multiple heat-generating modules simultaneously, effectively handling the thermal load from high-capacity, high-clock-rate memory systems without exceeding thermal constraints.
2Volume of moving object
If compact design is implemented, then device size is reduced, but heat dissipation becomes more difficult
Solution Approach 1:
The heat transfer system employs a nested structure where module heat conductors are positioned on memory modules, which are mounted on a circuit board. The central heat conductor then collects heat from multiple module heat conductors, and the cooling device is integrated into the system architecture. This nesting allows efficient heat management in a compact footprint by organizing thermal management components hierarchically.
3Temperature
If memory modules are thermally coupled to cooling devices, then heat transfer is improved, but device complexity increases
Solution Approach 1:
The central heat conductor serves multiple functions: it collects heat from multiple module heat conductors, acts as a heat distribution manifold, and provides a unified interface to the cooling device. This multi-functionality reduces the number of separate components needed, simplifying the overall system architecture while maintaining effective thermal coupling between memory modules and the cooling device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively manages heat transfer from memory modules to cooling devices, maintaining them within a defined temperature range, thereby overcoming thermal limitations and enabling increased memory capacity in compact computer systems.
Implementation Method 1
A heat transfer system (10) comprises module heat conductors (11) thermally connected to memory modules (3) via removable coupling elements (12), which are then linked to a central heat conductor (13) and a cooling device (14), utilizing materials with good thermal conductivity like graphite or copper
Data Source
AI summary
The memory module comprises a circuit board with a first and a second side, wherein memory chips are arranged at least on the first side. A longitudinally extending module heat conductor is arranged on the first side. The module heat conductor comprises a contact surface configured to contact a heat transfer system.