Modular Heatlet for Semiconductor Die Thermal Testing
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Solution Overview
Problem
Existing semiconductor die thermal testing equipment is expensive and requires multiple testing platforms for various die profiles with different thermal parameter requirements, lacking a simple and cost-effective solution.
Innovation Solution
A thermal testing device featuring a plug-and-play heatlet with heating and sensing circuitry, designed to match the geometry of semiconductor dies, which can be attached to a pedestal and configured for multiple die profiles and thermal test patterns, allowing for efficient heating and temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional thermal testing equipment is used, then testing capability is provided, but equipment cost and complexity increase significantly
Solution Approach 1:
The testing system is segmented into a modular heatlet component that can be independently attached to different pedestals. The heatlet contains integrated heating and sensing circuitry that can be detached and reused, separating the thermal testing function from the mechanical support structure. This segmentation reduces overall system complexity while maintaining testing reliability.
Solution Approach 2:
The heatlet is designed as a universal component that can be attached to multiple different pedestal types and configured for various die profiles through plate arrangements. The same heatlet assembly serves multiple testing functions and platforms, eliminating the need for multiple specialized testing equipment and reducing overall system complexity.
2Adaptability or versatility
If multiple testing platforms are used for different die profiles, then testing versatility is achieved, but equipment cost increases
Solution Approach 1:
The heatlet incorporates multiple plates that can be arranged in different configurations to match various die geometries. The same heatlet assembly can be used across multiple testing platforms and for different die profiles by simply reconfiguring the plate arrangement, providing versatility without requiring multiple specialized equipment sets.
Solution Approach 2:
The plate arrangement within the heatlet is designed to be dynamically reconfigurable, allowing the plates to be positioned, removed, or rearranged to accommodate different die profiles. This dynamic adaptability enables a single heatlet design to serve multiple testing scenarios, reducing the need for multiple fixed testing platforms.
3Temperature
If entire pedestal is heated for thermal testing, then uniform heating is achieved, but energy consumption and testing time increase
Solution Approach 1:
The heating function is extracted from the entire pedestal and concentrated into the heatlet component only. The heating circuitry is integrated specifically into the heatlet, allowing thermal energy to be applied locally to the testing area rather than heating the entire pedestal structure. This extraction of the heating function reduces energy consumption while maintaining sufficient heating uniformity for accurate thermal testing.
Solution Approach 2:
The heating and sensing circuitry are localized within the heatlet component, creating a focused thermal zone for testing. This local quality approach concentrates thermal energy where it is needed (at the die interface) rather than distributing it throughout the entire pedestal, reducing overall power consumption while maintaining adequate temperature uniformity for accurate measurements.
4Adaptability or versatility
If multiple testing platforms are used for different die profiles, then testing versatility is achieved, but time to configure and setup increases
Solution Approach 1:
The testing system is divided into a standardized heatlet module that can be quickly attached to different pedestals. This segmentation allows the thermal testing component to be independently configured and swapped without requiring reconfiguration of the entire testing platform, reducing setup time while maintaining versatility across different die profiles.
Solution Approach 2:
The heatlet is pre-configured with integrated heating and sensing circuitry that is ready for immediate use. The plate arrangements can be pre-positioned or quickly adjusted to match required die profiles before testing begins, eliminating the need for time-consuming on-site configuration of multiple specialized platforms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves energy and time savings during thermal testing by heating only the heatlet, reducing power consumption and testing time, while enabling flexible use across different die profiles and thermal test patterns.
Implementation Method 1
heating circuitry configured in operation to heat the one or more plates of the face
Implementation Method 2
sensing circuitry configured in operation to sense a temperature of the heatlet
Data Source
AI summary
A device for thermal testing one or more exposed or covered dies of an integrated circuit and a thermal tester for testing one or more exposed or covered dies of an integrated circuit on a testing platform are provided. The device for thermal testing the one or more exposed or covered dies of the integrated circuit includes a pedestal and a heatlet attached to a first end of the pedestal. The heatlet includes a face comprising one or more plates. The one or more plates are configured to match a geometry of the one or more dies. The heatlet also includes heating circuitry configured in operation to heat the one or more plates of the face and sensing circuitry configured in operation to sense a temperature of the heatlet.