Modular Heatsink Mounting for Optoelectronic Modules

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Solution Overview

Problem

Heat dissipation in optoelectronic modules is a challenge, as existing technologies often fail to provide a standardized and efficient means to manage varying power classes, leading to potential module malfunction or damage due to inadequate heat management.

Innovation Solution

A host system with standardized mounting arrangements for modular heatsinks, allowing for the removability and interchangeability of heatsinks based on the power class of the optoelectronic module, with features to prevent sliding contact and enhance thermal conductivity using thermal interface materials.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a standardized mounting arrangement for modular heatsinks is implemented, then adaptability to different power classes is improved, but device complexity increases due to the need for multiple heatsink configurations and mounting mechanisms

Engineering Contradiction:

Improveadaptability to different power classesVSAvoiddevice complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The heatsink system is segmented into modular units that can be independently selected and attached based on the specific power class requirements of the optoelectronic module. This allows the cooling solution to be divided into standardized segments that fit different thermal management needs without requiring a completely different system design for each power class.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The mounting arrangement is designed with universal features that can accommodate multiple heatsink types and configurations through a single standardized interface. The mounting mechanism serves multiple functions: securing the heatsink, providing thermal contact, and allowing for easy removal and replacement, thereby reducing the need for separate mounting systems for different power classes.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If thermal interface materials are used to enhance thermal conductivity, then heat dissipation efficiency is improved, but the risk of damaging the materials during module insertion increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoiddamage to thermal interface materials

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The system incorporates protective features that cushion and protect the thermal interface material during the module insertion process. This may include compliant mounting mechanisms or protective layers that prevent direct mechanical stress on the thermal interface material while still allowing effective thermal contact to be established, thereby preventing damage before it can occur during insertion.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Ease of operation

If modular heatsinks are made removable and interchangeable, then ease of maintenance and adaptation is improved, but manufacturing precision requirements increase to ensure proper thermal contact

Engineering Contradiction:

Improveease of maintenance and adaptationVSAvoidmanufacturing precision for thermal contact

Core Design Contradiction:

Ease of operationVSManufacturing precision

Solution Approach 1:

The mounting mechanism incorporates features that allow for parameter adjustment during assembly, such as adjustable mounting positions or compliant elements that can accommodate minor variations in manufacturing tolerances. This enables proper thermal contact to be achieved through simple adjustment rather than requiring extremely tight manufacturing precision, while still maintaining ease of removal and replacement.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables effective heat dissipation for optoelectronic modules of varying power classes, preventing damage and ensuring reliable operation by allowing the selection of appropriate heatsinks and integration of thermal interface materials without damaging them during insertion.

Implementation Method 1

integration of thermal interface materials

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

modular heatsink...dissipate heat

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 3

modular heatsink...dissipate heat

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS7859849B2Modular heatsink mounting system

Publication Date: 2010.12.28 II VI DELAWARE INC

AI summary

In one example, a host system includes a PCB, a plurality of rails disposed on the PCB, and a connector disposed on the PCB. The PCB, rails and connector define a slot configured to receive an optoelectronic module. The host system further includes means for removably mounting a modular heatsink to the host system such that the host system directly contacts the optoelectronic module when the optoelectronic module is fully inserted into the slot. The means for removably mounting has a standardized arrangement such that any modular heatsink having a mounting arrangement that is complementary to the standardized arranged can be removably mounted to the host system.