Modular Heatsink Assembly for Scalable IC Package Cooling

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Current heatsink designs for integrated circuits are often oversized and costly due to being based on worst-case scenarios, or require multiple inventory solutions for varying power levels, lacking flexibility and efficiency.

Innovation Solution

A modular heatsink system comprising a base spreader and a scalable secondary heat dissipation device, such as a fan or additional heatsink structures, that can be selectively attached to accommodate different power levels, from lower-power to higher-power integrated circuit devices.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a heatsink is designed for worst-case scenario to ensure integrated circuit device does not exceed temperature limit, then reliability is improved, but device size and cost increase

Engineering Contradiction:

Improvetemperature limit complianceVSAvoidheatsink size

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The heatsink is divided into a base spreader and multiple selectively attachable secondary heat dissipation devices. This segmentation allows the heatsink to be configured in different sizes and capacities depending on the specific thermal requirements, rather than always using a large worst-case design.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The heatsink configuration is made dynamic and adaptable through selective attachment of secondary heat dissipation devices. The system can be adjusted to match actual power levels and thermal requirements, transitioning from a static worst-case design to a dynamic,需求-driven configuration.

Inventive Principle:

Principle #15Dynamics

2Reliability

If a heatsink is designed for worst-case scenario, then temperature control is improved, but manufacturing cost increases

Engineering Contradiction:

Improvetemperature controlVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

By segmenting the heatsink into modular components (base spreader and secondary devices), manufacturing can be optimized. The base spreader can be produced in standard configurations, and secondary devices can be manufactured in different quantities based on actual needs, reducing overall manufacturing costs compared to producing every unit as a complete worst-case design.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The base spreader serves as a universal component that can be paired with different numbers and types of secondary heat dissipation devices. This multi-functionality allows a single base design to support multiple thermal requirements, reducing development and tooling costs.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Adaptability or versatility

If multiple inventory solutions are maintained for varying power levels, then adaptability is improved, but device complexity and inventory cost increase

Engineering Contradiction:

Improvepower level accommodationVSAvoidinventory management

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The heatsink is segmented into a common base spreader and interchangeable secondary heat dissipation devices. This allows customers to configure the appropriate level of cooling by selecting different numbers or types of secondary devices, rather than maintaining separate complete heatsink designs for each power level.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The base spreader is designed as a universal platform that can accommodate various configurations of secondary heat dissipation devices. This universality enables a single base component to serve multiple power level requirements, simplifying inventory management while maintaining adaptability.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The modular heatsink system efficiently dissipates heat across a range of power levels, reducing size and cost by allowing customization based on specific performance needs, while maintaining effective temperature management.

Implementation Method 1

a base spreader to attach to an integrated circuit package die... the base spreader is to dissipate heat from the integrated circuit package die

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a base spreader to attach to an integrated circuit package die... efficiently dissipates heat across a range of power levels

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 3

A secondary heat dissipation device, such as a fan or additional heatsink structures, that can be selectively attached

Methodology Applied

Scientific EffectForced convection: Forced Convection

Data Source

PatentUS20250372474A1Modular Heatsink for Integrated Circuit Package

Publication Date: 2025.12.04 ALTERA CORP

AI summary

Systems and methods for a modular heatsink system for integrated circuit devices are provided. A modular heatsink system may include a base spreader to attach to an integrated circuit package die. A secondary heat dissipation device may be selectively attachable to the base spreader. The base spreader dissipates a first amount of heat from the integrated circuit package die when the secondary heat dissipation device is not mated to the base spreader. The base spreader and the secondary heat dissipation device collectively dissipate a greater amount of heat when the secondary heat dissipation device is mated to the base spreader.