Modular Heatsink Segmentation for Solid State Lighting Weight Reduction
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Solution Overview
Problem
Solid state lighting (SSL) lamps face challenges in reducing weight while maintaining structural integrity and thermal efficiency, particularly when replacing traditional lamps like HPS and CFLs, as heavier heat sinks are required for increased luminous power, leading to weight and cost issues.
Innovation Solution
The SSL lamp design features heatsink modules affixed to a separate lightweight body using tongue and groove couplings, allowing for thinner, more cost-effective heatsinks and improved thermal dissipation through air flow, with the body made of polymer materials and heatsinks potentially made of bent sheet metal or extruded aluminum.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If heatsink modules are made thicker to provide structural integrity, then structural strength is improved, but weight increases
Solution Approach 1:
The heatsink is divided into multiple thin modular units that are interconnected through tongue and groove joints. Each module is thin and lightweight, but the interconnected structure provides overall structural integrity. This segmentation allows the heatsink to maintain strength without requiring each individual component to be thick and heavy.
Solution Approach 2:
Multiple thin heatsink modules are combined through tongue and groove coupling to form a unified structural assembly. The combination of these thin modules creates a structure with sufficient integrity while maintaining the weight advantages of thin individual components. The merged structure provides both the structural strength and the thermal dissipation surface area needed.
2Temperature
If heatsink modules are made thicker for thermal dissipation, then thermal management is improved, but weight increases
Solution Approach 1:
The heatsink is segmented into multiple thin modules with increased total surface area. The segmentation allows heat to be dissipated across a larger area through the thin modules, compensating for the reduced thickness of individual modules. The combined surface area of all thin modules exceeds that of a single thick heatsink, providing superior thermal dissipation while reducing weight.
Solution Approach 2:
Instead of increasing thermal dissipation capacity by adding thickness in one dimension, the design uses multiple thin modules arranged to maximize surface area in three-dimensional space. The tongue and groove structure allows modules to be positioned to optimize heat exposure and air flow, effectively using spatial arrangement to enhance thermal performance without increasing material thickness.
3Weight of moving object
If heatsink modules are made thinner to reduce weight, then weight is reduced, but structural integrity deteriorates
Solution Approach 1:
Thin heatsink modules are combined through tongue and groove coupling to create a unified structure with sufficient integrity. The interconnection of multiple thin modules provides the structural strength needed to support the LED arrays and maintain rigidity, while each individual module remains thin and lightweight. The combined structure behaves as a single robust component despite being assembled from thin elements.
Solution Approach 2:
The heatsink is segmented into modular units with built-in connection features (tongue and groove). This segmentation allows each module to be thin and lightweight, while the connection features provide the structural linkage needed for overall integrity. The modular design enables the structure to achieve strength through configuration rather than material thickness.
4Ease of manufacture
If heatsink modules are made thinner for cost reduction, then manufacturing cost is reduced, but thermal dissipation capacity deteriorates
Solution Approach 1:
The heatsink is segmented into multiple thin modules, each of which can be manufactured using cost-effective processes for thin materials. The segmentation allows use of thinner, cheaper materials while the combined surface area of all modules provides sufficient thermal dissipation capacity. The modular design also enables efficient manufacturing and assembly processes.
Solution Approach 2:
The design compensates for reduced thickness by optimizing the three-dimensional arrangement of multiple thin modules. The modules are configured to maximize exposed surface area and optimize air flow paths, ensuring that thermal dissipation capacity is maintained despite the reduced thickness of individual components. This spatial optimization allows thin modules to achieve the thermal performance previously requiring thicker materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the overall weight and cost of the SSL lamp while maintaining structural integrity and enhancing thermal management, allowing for efficient heat transfer and aesthetically pleasing form factors.
Implementation Method 1
each heatsink module... carrying a plurality of solid state lighting elements on the outward facing surface
Implementation Method 2
an air flow through the solid state lighting lamp along its central axis can be facilitated, as the spacing between adjacent heatsink modules allows for more effective heat transfer between the heatsink modules and the air flow
Data Source
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AI summary
A solid state lighting lamp (10) is disclosed comprising a plurality of heatsink modules (40) each extending in alignment with a central axis (15) of the lamp, each heatsink module carrying a plurality of solid state lighting elements (50); and a body (20) extending in alignment with said central axis and delimiting an inner volume of the lamp, wherein the heatsink modules are affixed to said body. The body is the optical housing, i.e. the light exit window of the lamp.