Modular High-Density Connector Assembly with Bifurcated Tips
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Solution Overview
Problem
Existing high-density connectors for automatic testing equipment face issues such as high manufacturing costs, impedance discontinuities, low density, and non-field-replaceable components, which lead to inefficiencies and increased maintenance costs.
Innovation Solution
A modular high-density connector assembly with field-replaceable sub-assemblies and contacts, featuring bifurcated tips for improved contact reliability and a compact design, utilizing a frame and peg system for secure connection and easy replacement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If pogo pins are used to create high-density connections, then connection density is improved, but the connector length increases and manufacturing complexity increases
Solution Approach 1:
The connector is divided into multiple circuit boards arranged in a stack, with contacts distributed across different layers. This segmentation allows high connection density without requiring excessively long individual contacts, as connections are achieved through inter-board routing rather than single long pins.
Solution Approach 2:
The invention transitions from a single-plane connector to a three-dimensional stacked configuration. Multiple circuit boards are arranged vertically with contacts on both sides of each board, utilizing the Z-dimension to achieve high connection density while keeping individual contact lengths manageable.
2Quantity of substance
If pogo pins are used for high-density connections, then connection density is improved, but manufacturing cost and impedance control difficulty increase
Solution Approach 1:
By segmenting the connector into standard circuit boards with conventional contact structures, the invention leverages established manufacturing processes. Each board can be manufactured independently using standard PCB techniques, avoiding the custom manufacturing requirements of pogo pins while achieving high overall connection density.
Solution Approach 2:
The invention changes the structural parameters from long, flexible pogo pins to rigid, planar circuit board traces. This parameter change enables the use of standard manufacturing processes and improves impedance control through consistent trace geometry, while still achieving high connection density through the stacked multi-board configuration.
3Reliability
If compression contacts are used to ensure proper connection, then connection reliability is improved, but the downward force required increases and connector lifespan decreases
Solution Approach 1:
The connector incorporates spring elements that provide dynamic, elastic contact force. These springs maintain constant contact pressure between mating surfaces through elastic deformation, ensuring reliable electrical connection without requiring excessive static downward force. The elastic nature of the springs also allows for repeated mating cycles, extending connector lifespan.
4Stability of the object's composition
If the entire connector is non-replaceable, then structural integrity is maintained, but maintenance cost and time increase
Solution Approach 1:
The connector is designed as a modular stack of independent circuit boards that can be individually replaced. This segmentation maintains overall structural integrity through standardized mechanical and electrical interfaces between boards, while enabling easy maintenance by allowing individual board replacement without affecting the entire connector assembly.
Solution Approach 2:
The modular design enables individual circuit boards to be discarded and replaced independently when defective. The standardized interfaces allow for quick recovery and reassembly of functional boards, significantly reducing maintenance time and cost compared to replacing entire non-modular connectors, while maintaining structural integrity through consistent mating mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces the downward force required for connection, increases connector lifespan, and allows for cost-effective field replacement, enhancing reliability and efficiency in automatic testing applications.
Implementation Method 1
a spring disposed in the socket that pushes the pin away from the socket
Data Source
AI summary
A high-density connector assembly includes a frame, at least one sub-assembly connected to the frame, at least one connector connected to the at least one sub-assembly, a plurality of contacts disposed in the connector, a circuit board disposed in the connector; and a plurality of cables. Each of the plurality of cables is connected to a corresponding one of the plurality of contacts. At least one of the plurality of contacts has a bifurcated tip.