Modular HMD Strap With Thermal Conduit and Dongle Connectivity
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Solution Overview
Problem
Conventional head-mounted display (HMD) systems face challenges in thermal ergonomics due to reduced form factors that concentrate thermal elements near the user, leading to user discomfort and component degradation, while lacking efficient connectivity for testing and software development.
Innovation Solution
The HMD system incorporates a modular securement assembly with removable straps featuring a thermal shell and thermal conduit, along with a dongle for power and data connectivity, and a processor that throttles bandwidth in response to thermal output, utilizing thermal spreaders and interface materials to dissipate heat effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If HMD system components are designed with reduced form factors, then device compactness is improved, but thermal elements are concentrated closer to the user causing discomfort
Solution Approach 1:
The patent extracts thermal management functions from the main HMD body by introducing separate thermal shells and conduits that channel heat away from the user's face. The thermal shell is positioned to receive heat from internal components and redirect it through designated pathways, separating the thermal load from the user-contact areas.
Solution Approach 2:
The thermal conduit acts as an intermediary between heat-generating components and the external environment. It provides a dedicated thermal pathway that mediates heat transfer, directing thermal energy away from the user through structured routes involving thermal shells and conduits positioned strategically around the HMD.
2Volume of moving object
If HMD system components are designed with reduced form factors, then device compactness is improved, but thermal elements are concentrated closer to the user causing component degradation
Solution Approach 1:
The thermal management system is extracted as a separate functional layer within the HMD structure. Thermal shells and conduits are positioned to intercept heat before it reaches critical components, effectively removing thermal stress from the component assembly while maintaining compact form factor.
3Ease of manufacture
If conventional HMD systems use standard connectivity interfaces, then manufacturing simplicity is maintained, but testing and software development efficiency is reduced
Solution Approach 1:
The connectivity interface is designed with multi-functionality to serve both manufacturing standards and development needs. The interface supports standard protocols for manufacturing compatibility while incorporating enhanced capabilities for testing and software development, including improved data transfer rates and diagnostic functionality.
4Volume of moving object
If thermal elements are concentrated in compact HMD design, then device compactness is improved, but user comfort is reduced
Solution Approach 1:
The thermal conduit serves as an intermediary that protects the user from thermal discomfort while maintaining compact design. It intercepts thermal energy and redirects it through controlled pathways, acting as a buffer between heat-generating components and the user's face, thereby preserving user comfort.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances user comfort by reducing thermal load and improves connectivity for faster data transfer and testing, while maintaining component integrity.
Implementation Method 1
the thermal spreader is configured to dissipate thermal energy from the electronics pod
Implementation Method 2
the thermal interface material comprises at least one of a copper layer or a graphite layer
Data Source
AI summary
A head-mountable display (HMD) system includes a display portion, a modular securement assembly connectable to the display portion, and a dongle configured to connect the removable strap to at least one of a power supply, a computing device, or an external display. In some examples, the modular securement assembly includes: a removable strap with an electronics pod with a thermal shell and a thermal conduit; and a retention band connectable to the removable strap.